Issued Patents All Time
Showing 1–25 of 87 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11295982 | Forming ultra-thin chips for flexible electronics applications | Katsuyuki Sakuma, Huan Hu | 2022-04-05 |
| 11227796 | Enhancement of iso-via reliability | Lawrence A. Clevenger, Baozhen Li, Kirk D. Peterson | 2022-01-18 |
| 11133259 | Multi-chip package structure having high density chip interconnect bridge with embedded power distribution network | Joshua M. Rubin, Arvind Kumar, Lawrence A. Clevenger, Steven L. Wright, Wiren D. Becker | 2021-09-28 |
| 11015913 | Flexible electronics for wearable healthcare sensors | Huan Hu, Ning Li, Katsuyuki Sakuma | 2021-05-25 |
| 10964881 | Piezoelectronic device with novel force amplification | Bruce G. Elmegreen, Marcelo A. Kuroda, Glenn J. Martyna, Dennis M. Newns, Paul M. Solomon | 2021-03-30 |
| 10957657 | Advanced crack stop structure | Chih-Chao Yang, Baozhen Li, Griselda Bonilla | 2021-03-23 |
| 10847475 | Advanced crack stop structure | Chih-Chao Yang, Baozhen Li, Griselda Bonilla | 2020-11-24 |
| 10840194 | Advanced crack stop structure | Chih-Chao Yang, Baozhen Li, Griselda Bonilla | 2020-11-17 |
| 10840195 | Advanced crack stop structure | Chih-Chao Yang, Baozhen Li, Griselda Bonilla | 2020-11-17 |
| 10622220 | Nanofluidic channel fabrication by controlled spontaneous fracturing | Huan Hu, Jianshi Tang, Ning Li | 2020-04-14 |
| 10546809 | Wafer-scale power delivery | Charles E. Cox, Harald Huels, Arvind Kumar, Ahmet S. Ozcan, Winfried W. Wilcke | 2020-01-28 |
| 10490513 | Advanced crack stop structure | Chih-Chao Yang, Baozhen Li, Griselda Bonilla | 2019-11-26 |
| 10475753 | Advanced crack stop structure | Chih-Chao Yang, Baozhen Li, Griselda Bonilla | 2019-11-12 |
| 10460985 | Enhancement of iso-via reliability | Lawrence A. Clevenger, Baozhen Li, Kirk D. Peterson | 2019-10-29 |
| 10388567 | Thru-silicon-via structures | Fen Chen, Mukta G. Farooq, Carole D. Graas | 2019-08-20 |
| 10359269 | Flexible electronics for wearable healthcare sensors | Huan Hu, Ning Li, Katsuyuki Sakuma | 2019-07-23 |
| 10147676 | Wafer-scale power delivery | Charles E. Cox, Harald Huels, Arvind Kumar, Ahmet S. Ozcan, Winfried W. Wilcke | 2018-12-04 |
| 9941472 | Piezoelectronic device with novel force amplification | Bruce G. Elmegreen, Marcelo A. Kuroda, Glenn J. Martyna, Dennis M. Newns, Paul M. Solomon | 2018-04-10 |
| 9812359 | Thru-silicon-via structures | Fen Chen, Mukta G. Farooq, Carole D. Graas | 2017-11-07 |
| 9761482 | Enhancement of iso-via reliability | Lawrence A. Clevenger, Baozhen Li, Kirk D. Peterson | 2017-09-12 |
| 9738560 | Controlling fragmentation of chemically strengthened glass | Cyril Cabral, Jr., Fuad E. Doany, Gregory M. Fritz, Michael S. Gordon, Qiang Huang +3 more | 2017-08-22 |
| 9670061 | Flexible electronics for wearable healthcare sensors | Huan Hu, Ning Li, Katsuyuki Sakuma | 2017-06-06 |
| 9586857 | Controlling fragmentation of chemically strengthened glass | Cyril Cabral, Jr., Fuad E. Doany, Gregory M. Fritz, Michael S. Gordon, Qiang Huang +3 more | 2017-03-07 |
| 9565759 | Axiocentric scrubbing land grid array contacts and methods for fabrication | Gareth G. Hougham, Gerard McVicker, Xiaoxiong Gu, Sung K. Kang, Frank R. Libsch | 2017-02-07 |
| 9536842 | Structure with air gap crack stop | Junjing Bao, Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Naftali E. Lustig +1 more | 2017-01-03 |