Issued Patents All Time
Showing 1–25 of 114 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10770407 | IC structure with interdigitated conductive elements between metal guard structures | Zhuojie Wu, Cathryn J. Christiansen, Erdem Kaltalioglu, Ping-Chuan Wang, Eric D. Hunt-Schroeder +1 more | 2020-09-08 |
| 10475677 | Parallel test structure | Tian Shen, Anil Kumar, Yuncheng Song, Kong Boon Yeap, Linjun Cao +3 more | 2019-11-12 |
| 10388617 | Mechanically anchored C4 pad and method of forming same | Erdem Kaltalioglu, Ping-Chuan Wang | 2019-08-20 |
| 10325862 | Wafer rigidity with reinforcement structure | Erdem Kaltalioglu, Andrew Tae Kim, Ping-Chuan Wang | 2019-06-18 |
| 10297546 | Interconnect structures for a security application | Erdem Kaltalioglu, Ping-Chuan Wang, Cathryn J. Christiansen | 2019-05-21 |
| 10256186 | Interconnect structure having subtractive etch feature and damascene feature | Griselda Bonilla, Samuel S. Choi, Elbert E. Huang, Naftali E. Lustig, Andrew H. Simon | 2019-04-09 |
| 10229875 | Stacked via structure for metal fuse applications | Griselda Bonilla, Kaushik Chanda, Stephan Grunow, Naftali E. Lustig, Andrew H. Simon +1 more | 2019-03-12 |
| 10224236 | Forming air gap | Samuel S. Choi, Elbert E. Huang, Naftali E. Lustig, Griselda Bonilla, Andrew H. Simon | 2019-03-05 |
| 10177031 | Subtractive etch interconnects | Junjing Bao, Griselda Bonilla, Samuel S. Choi, Naftali E. Lustig, Andrew H. Simon | 2019-01-08 |
| 10103068 | Detecting a void between a via and a wiring line | Griselda Bonilla, Samuel S. Choi, Elbert E. Huang, Naftali E. Lustig, Andrew H. Simon | 2018-10-16 |
| 9893011 | Back-end electrically programmable fuse | Junjing Bao, Griselda Bonilla, Kaushik Chanda, Samuel S. Choi, Stephan Grunow +3 more | 2018-02-13 |
| 9852980 | Interconnect structure having substractive etch feature and damascene feature | Griselda Bonilla, Samuel S. Choi, Elbert E. Huang, Naftali E. Lustig, Andrew H. Simon | 2017-12-26 |
| 9817063 | Interconnect reliability structures | Ping-Chuan Wang, Andrew Tae Kim | 2017-11-14 |
| 9768065 | Interconnect structures with variable dopant levels | Ping-Chuan Wang, Erdem Kaltalioglu, Cathryn J. Christiansen | 2017-09-19 |
| 9761539 | Wafer rigidity with reinforcement structure | Erdem Kaltalioglu, Andrew Tae Kim, Ping-Chuan Wang | 2017-09-12 |
| 9741657 | TSV deep trench capacitor and anti-fuse structure | Erdem Kaltalioglu, Shahab Siddiqui, Ping-Chuan Wang, Lijuan Zhang | 2017-08-22 |
| 9685404 | Back-end electrically programmable fuse | Junjing Bao, Griselda Bonilla, Kaushik Chanda, Samuel S. Choi, Stephan Grunow +3 more | 2017-06-20 |
| 9673089 | Interconnect structure with enhanced reliability | Griselda Bonilla, Kaushik Chanda, Robert D. Edwards, Andrew H. Simon, Ping-Chuan Wang | 2017-06-06 |
| 9601426 | Interconnect structure having subtractive etch feature and damascene feature | Griselda Bonilla, Samuel S. Choi, Elbert E. Huang, Naftali E. Lustig, Andrew H. Simon | 2017-03-21 |
| 9536842 | Structure with air gap crack stop | Junjing Bao, Griselda Bonilla, Samuel S. Choi, Xiao Hu Liu, Naftali E. Lustig +1 more | 2017-01-03 |
| 9536830 | High performance refractory metal / copper interconnects to eliminate electromigration | Junjing Bao, Griselda Bonilla, Samuel S. Choi, Naftali E. Lustig, Andrew H. Simon | 2017-01-03 |
| 9536779 | Selective local metal cap layer formation for improved electromigration behavior | Erdem Kaltalioglu, Ping-Chuan Wang, Lijuan Zhang | 2017-01-03 |
| 9524916 | Structures and methods for determining TDDB reliability at reduced spacings using the structures | Erdem Kaltalioglu, Naftali E. Lustig, Ping-Chuan Wang, Lijuan Zhang | 2016-12-20 |
| 9502350 | Interconnect scaling method including forming dielectric layer over subtractively etched first conductive layer and forming second conductive material on dielectric layer | Griselda Bonilla, Samuel S. Choi, Elbert E. Huang, Naftali E. Lustig, Andrew H. Simon | 2016-11-22 |
| 9478509 | Mechanically anchored backside C4 pad | Erdem Kaltalioglu, Andrew Tae Kim, Ping-Chuan Wang, Lijuan Zhang | 2016-10-25 |