Issued Patents All Time
Showing 1–25 of 74 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10770407 | IC structure with interdigitated conductive elements between metal guard structures | Zhuojie Wu, Cathryn J. Christiansen, Ping-Chuan Wang, Ronald G. Filippi, Eric D. Hunt-Schroeder +1 more | 2020-09-08 |
| 10438890 | Interconnect structure having power rail structure and related method | Atsushi Ogino | 2019-10-08 |
| 10388617 | Mechanically anchored C4 pad and method of forming same | Ping-Chuan Wang, Ronald G. Filippi | 2019-08-20 |
| 10325862 | Wafer rigidity with reinforcement structure | Ronald G. Filippi, Andrew Tae Kim, Ping-Chuan Wang | 2019-06-18 |
| 10304783 | Wafer reinforcement to reduce wafer curvature | Andrew Tae Kim, Chengwen Pei, Ping-Chuan Wang | 2019-05-28 |
| 10297546 | Interconnect structures for a security application | Ronald G. Filippi, Ping-Chuan Wang, Cathryn J. Christiansen | 2019-05-21 |
| 9997456 | Interconnect structure having power rail structure and related method | Atsushi Ogino | 2018-06-12 |
| 9947602 | IC structure integrity sensor having interdigitated conductive elements | Zhuojie Wu | 2018-04-17 |
| 9852999 | Wafer reinforcement to reduce wafer curvature | Andrew Tae Kim, Chengwen Pei, Ping-Chuan Wang | 2017-12-26 |
| 9768065 | Interconnect structures with variable dopant levels | Ping-Chuan Wang, Ronald G. Filippi, Cathryn J. Christiansen | 2017-09-19 |
| 9761539 | Wafer rigidity with reinforcement structure | Ronald G. Filippi, Andrew Tae Kim, Ping-Chuan Wang | 2017-09-12 |
| 9741657 | TSV deep trench capacitor and anti-fuse structure | Ronald G. Filippi, Shahab Siddiqui, Ping-Chuan Wang, Lijuan Zhang | 2017-08-22 |
| 9553054 | Strain detection structures for bonded wafers and chips | Mukta G. Farooq, John A. Fitzsimmons, Wei Lin, Spyridon Skordas, Kevin R. Winstel | 2017-01-24 |
| 9536779 | Selective local metal cap layer formation for improved electromigration behavior | Ronald G. Filippi, Ping-Chuan Wang, Lijuan Zhang | 2017-01-03 |
| 9524916 | Structures and methods for determining TDDB reliability at reduced spacings using the structures | Ronald G. Filippi, Naftali E. Lustig, Ping-Chuan Wang, Lijuan Zhang | 2016-12-20 |
| 9478509 | Mechanically anchored backside C4 pad | Ronald G. Filippi, Andrew Tae Kim, Ping-Chuan Wang, Lijuan Zhang | 2016-10-25 |
| 9431293 | Selective local metal cap layer formation for improved electromigration behavior | Ronald G. Filippi, Ping-Chuan Wang, Lijuan Zhang | 2016-08-30 |
| 9373596 | Passivated copper chip pads | Thomas Goebel, Markus Naujok | 2016-06-21 |
| 9330974 | Through level vias and methods of formation thereof | Sunoo Kim, Muhammed Shafi Pallachalil, Moosung Chae | 2016-05-03 |
| 9305879 | E-fuse with hybrid metallization | Ronald G. Filippi, Andrew Tae Kim, Ping-Chuan Wang, Lijuan Zhang | 2016-04-05 |
| 9123726 | Selective local metal cap layer formation for improved electromigration behavior | Ronald G. Filippi, Ping-Chuan Wang, Lijuan Zhang | 2015-09-01 |
| 9082781 | Semiconductor article having a zig-zag guard ring and method of forming the same | Ronald G. Filippi, Xiao Hu Liu, Thomas M. Shaw, Ping-Chuan Wang, Bucknell C. Webb +1 more | 2015-07-14 |
| 9059333 | Facilitating chip dicing for metal-metal bonding and hybrid wafer bonding | Mukta G. Farooq, Wei Lin, Spyridon Skordas, Kevin R. Winstel | 2015-06-16 |
| 9059173 | Electronic fuse line with modified cap | Ronald G. Filippi, John A. Fitzsimmons, Ping-Chuan Wang, Lijuan Zhang | 2015-06-16 |
| 9059170 | Electronic fuse having a damaged region | Junjing Bao, Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Wai-Kin Li +4 more | 2015-06-16 |