| 12419062 |
Method for manufacturing semiconductor device including capacitor structure having lower electrode with different lengths |
— |
2025-09-16 |
|
| 11829546 |
Border touch module |
Ching-Kai Cho, Zhi Juan Lin, Ting-Chieh Chien, Hua Li Luo |
2023-11-28 |
|
| 11586314 |
Border touch module |
Ching-Kai Cho, Zhi Juan Lin, Ting-Chieh Chien, Hua Li Luo |
2023-02-21 |
|
| 10777433 |
Gas-controlled bonding platform for edge defect reduction during wafer bonding |
Spyridon Skordas, Robert R. Young |
2020-09-15 |
|
| 10615139 |
Semiconductor device including built-in crack-arresting film structure |
Leathen Shi, Spyridon Skordas, Kevin R. Winstel |
2020-04-07 |
$1,846,000 |
| 10332837 |
Enhancing barrier in air gap technology |
Takeshi Nogami |
2019-06-25 |
$2,152,000 |
| 10276500 |
Enhancing barrier in air gap technology |
Takeshi Nogami |
2019-04-30 |
$3,198,000 |
| 10269760 |
Advanced chip to wafer stacking |
Spyridon Skordas |
2019-04-23 |
$3,141,000 |
| 10211178 |
Semiconductor device including built-in crack-arresting film structure |
Leathen Shi, Spyridon Skordas, Kevin R. Winstel |
2019-02-19 |
$3,019,000 |
| 10170447 |
Advanced chip to wafer stacking |
Spyridon Skordas |
2019-01-01 |
|
| 10157757 |
Gas-controlled bonding platform for edge defect reduction during wafer bonding |
Spyridon Skordas, Robert R. Young |
2018-12-18 |
$3,830,000 |
| 10056272 |
Gas-controlled bonding platform for edge defect reduction during wafer bonding |
Spyridon Skordas, Robert R. Young |
2018-08-21 |
$2,787,000 |
| 10047264 |
Polymer composite thermal interface material with high thermal conductivity |
— |
2018-08-14 |
$4,051,000 |
| 10020279 |
Semiconductor device including built-in crack-arresting film structure |
Leathen Shi, Spyridon Skordas, Kevin R. Winstel |
2018-07-10 |
$4,870,000 |
| 9922851 |
Gas-controlled bonding platform for edge defect reduction during wafer bonding |
Spyridon Skordas, Robert R. Young |
2018-03-20 |
$2,525,000 |
| 9881896 |
Advanced chip to wafer stacking |
Spyridon Skordas |
2018-01-30 |
$2,622,000 |
| 9847295 |
Enhancing barrier in air gap technology |
Takeshi Nogami |
2017-12-19 |
$7,368,000 |
| 9806032 |
Integrated circuit structure with refractory metal alignment marker and methods of forming same |
Nailong HE, Upinder Singh |
2017-10-31 |
$7,902,000 |
| 9640514 |
Wafer bonding using boron and nitrogen based bonding stack |
Troy L. Graves-Abe, Donald F. Canaperi, Spyridon Skordas, Matthew T. Shoudy, Binglin Miao +2 more |
2017-05-02 |
$5,255,000 |
| 9620481 |
Substrate bonding with diffusion barrier structures |
Daniel C. Edelstein, Douglas C. La Tulipe, Jr., Deepika Priyadarshini, Spyridon Skordas, Tuan A. Vo +1 more |
2017-04-11 |
$14,156,000 |
| 9564386 |
Semiconductor package with structures for cooling fluid retention |
Son V. Nguyen, Spyridon Skordas, Tuan A. Vo |
2017-02-07 |
$2,910,000 |
| 9553054 |
Strain detection structures for bonded wafers and chips |
Mukta G. Farooq, John A. Fitzsimmons, Erdem Kaltalioglu, Spyridon Skordas, Kevin R. Winstel |
2017-01-24 |
$6,909,000 |
| 9536853 |
Semiconductor device including built-in crack-arresting film structure |
Leathen Shi, Spyridon Skordas, Kevin R. Winstel |
2017-01-03 |
$2,646,000 |
| 9472457 |
Manganese oxide hard mask for etching dielectric materials |
Spyridon Skordas, Tuan A. Vo |
2016-10-18 |
$1,445,000 |
| 9466538 |
Method to achieve ultra-high chip-to-chip alignment accuracy for wafer-to-wafer bonding process |
Spyridon Skordas, Subramanian S. Iyer, Donald F. Canaperi, Shidong Li |
2016-10-11 |
$4,519,000 |
