Issued Patents All Time
Showing 26–36 of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9401303 | Handler wafer removal by use of sacrificial inert layer | Kangguo Cheng, Jonathan E. Faltermeier, Mukta G. Farooq, Spyridon Skordas, Kevin R. Winstel | 2016-07-26 |
| 9263389 | Enhancing barrier in air gap technology | Takeshi Nogami | 2016-02-16 |
| 9263366 | Liquid cooling of semiconductor chips utilizing small scale structures | Son V. Nguyen, Spyridon Skordas, Tuan A. Vo | 2016-02-16 |
| 9190303 | Reducing wafer bonding misalignment by varying thermal treatment prior to bonding | Douglas C. La Tulipe, Jr., Spyridon Skordas, Kevin R. Winstel | 2015-11-17 |
| 9142488 | Manganese oxide hard mask for etching dielectric materials | Spyridon Skordas, Tuan A. Vo | 2015-09-22 |
| 9064937 | Substrate bonding with diffusion barrier structures | Daniel C. Edelstein, Douglas C. La Tulipe, Jr., Deepika Priyadarshini, Spyridon Skordas, Tuan A. Vo +1 more | 2015-06-23 |
| 9059039 | Reducing wafer bonding misalignment by varying thermal treatment prior to bonding | Douglas C. La Tulipe, Jr., Spyridon Skordas, Kevin R. Winstel | 2015-06-16 |
| 9059333 | Facilitating chip dicing for metal-metal bonding and hybrid wafer bonding | Mukta G. Farooq, Erdem Kaltalioglu, Spyridon Skordas, Kevin R. Winstel | 2015-06-16 |
| 9058974 | Distorting donor wafer to corresponding distortion of host wafer | Spyridon Skordas, Tuan A. Vo | 2015-06-16 |
| 9054109 | Corrosion/etching protection in integration circuit fabrications | Son V. Nguyen, Vamsi K. Paruchuri, Tuan A. Vo | 2015-06-09 |
| 9028628 | Wafer-to-wafer oxide fusion bonding | Deepika Priyadarshini, Spyridon Skordas, Tuan A. Vo | 2015-05-12 |