Issued Patents All Time
Showing 1–25 of 87 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12322593 | Selective passivation and selective deposition | Jan Willem Maes, Michael Eugene Givens, Suvi Haukka, Ivo Raaijmakers, Shaoren Deng +4 more | 2025-06-03 |
| 11830732 | Selective passivation and selective deposition | Jan Willem Maes, Michael Eugene Givens, Suvi Haukka, Ivo Raaijmakers, Shaoren Deng +4 more | 2023-11-28 |
| 11177167 | Ultrathin multilayer metal alloy liner for nano Cu interconnects | Daniel C. Edelstein, Alfred Grill, Seth L. Knupp, Son V. Nguyen, Takeshi Nogami +2 more | 2021-11-16 |
| 11145506 | Selective passivation and selective deposition | Jan Willem Maes, Michael Eugene Givens, Suvi Haukka, Ivo Raaijmakers, Shaoren Deng +3 more | 2021-10-12 |
| 10930566 | Complementary metal oxide semiconductor replacement gate high-k metal gate devices with work function adjustments | Lisa F. Edge, Hemanth Jagannathan, Paul C. Jamison | 2021-02-23 |
| 10643890 | Ultrathin multilayer metal alloy liner for nano Cu interconnects | Daniel C. Edelstein, Alfred Grill, Seth L. Knupp, Son V. Nguyen, Takeshi Nogami +2 more | 2020-05-05 |
| 10573565 | Complementary metal oxide semiconductor replacement gate high-k metal gate devices with work function adjustments | Lisa F. Edge, Hemanth Jagannathan, Paul C. Jamison | 2020-02-25 |
| 10304746 | Complementary metal oxide semiconductor replacement gate high-K metal gate devices with work function adjustments | Lisa F. Edge, Hemanth Jagannathan, Paul C. Jamison | 2019-05-28 |
| 10008449 | Self-forming barrier for subtractive copper | Theodorus E. Standaert | 2018-06-26 |
| 9881797 | Replacement gate electrode with multi-thickness conductive metallic nitride layers | Hemanth Jagannathan | 2018-01-30 |
| 9721893 | Self-forming barrier for subtractive copper | Theodorus E. Standaert | 2017-08-01 |
| 9589845 | Fin cut enabling single diffusion breaks | Hemanth Jagannathan, Sivananda K. Kanakasabapathy, Alexander Reznicek | 2017-03-07 |
| 9564505 | Changing effective work function using ion implantation during dual work function metal gate integration | Michael P. Chudzik, Martin M. Frank, Herbert L. Ho, Mark J. Hurley, Rashmi Jha +3 more | 2017-02-07 |
| 9490255 | Complementary metal oxide semiconductor replacement gate high-k metal gate devices with work function adjustments | Lisa F. Edge, Hemanth Jagannathan, Paul C. Jamison | 2016-11-08 |
| 9449874 | Self-forming barrier for subtractive copper | Theodorus E. Standaert | 2016-09-20 |
| 9412629 | Wafer bonding for 3D device packaging fabrication | Son V. Nguyen, Deepika Priyadarshini, Tuan A. Vo | 2016-08-09 |
| 9305883 | Locally raised epitaxy for improved contact by local silicon capping during trench silicide processings | Sebastian Naczas, Alexander Reznicek, Dominic J. Schepis | 2016-04-05 |
| 9236314 | High-K/metal gate stack using capping layer methods, IC and related transistors | Michael P. Chudzik, Naim Moumen, Vijay Narayanan, Dae-Gyu Park | 2016-01-12 |
| 9202698 | Replacement gate electrode with multi-thickness conductive metallic nitride layers | Hemanth Jagannathan | 2015-12-01 |
| 9129099 | Portable health record system and method | — | 2015-09-08 |
| 9059314 | Structure and method to obtain EOT scaled dielectric stacks | Hemanth Jagannathan, Takashi Ando, Lisa F. Edge, Sufi Zafar, Changhwan Choi +2 more | 2015-06-16 |
| 9054109 | Corrosion/etching protection in integration circuit fabrications | Wei Lin, Son V. Nguyen, Tuan A. Vo | 2015-06-09 |
| 9053926 | Cyclical physical vapor deposition of dielectric layers | Paul C. Jamison, Juntao Li, Tuan A. Vo, Takaaki Tsunoda, Sanjay Shinde | 2015-06-09 |
| 8999779 | Locally raised epitaxy for improved contact by local silicon capping during trench silicide processings | Sebastian Naczas, Alexander Reznicek, Dominic J. Schepis | 2015-04-07 |
| 8981466 | Multilayer dielectric structures for semiconductor nano-devices | Alfred Grill, Seth L. Knupp, Son V. Nguyen, Deepika Priyadarshini, Hosadurga Shobha | 2015-03-17 |