SN

Sebastian Naczas

IBM: 13 patents #8,581 of 70,183Top 15%
Globalfoundries: 1 patents #2,221 of 4,424Top 55%
SF SUNY Research Foundation: 1 patents #430 of 1,231Top 35%
📍 Albany, NY: #115 of 790 inventorsTop 15%
🗺 New York: #9,734 of 115,490 inventorsTop 9%
Overall (All Time): #317,914 of 4,157,543Top 8%
15
Patents All Time

Issued Patents All Time

Showing 1–15 of 15 patents

Patent #TitleCo-InventorsDate
10950492 Fabrication of vertical transport fin field effect transistors with a self-aligned separator and an isolation region with an air gap Kangguo Cheng, Zuoguang Liu, Heng Wu, Peng Xu 2021-03-16
10811599 Co-fabrication of magnetic device structures with electrical interconnects having reduced resistance through increased conductor grain size Lawrence A. Clevenger, Liying Jiang, Michael Rizzolo, Chih-Chao Yang 2020-10-20
10756260 Co-fabrication of magnetic device structures with electrical interconnects having reduced resistance through increased conductor grain size Lawrence A. Clevenger, Liying Jiang, Michael Rizzolo, Chih-Chao Yang 2020-08-25
10559491 Fabrication of vertical transport fin field effect transistors with a self-aligned separator and an isolation region with an air gap Kangguo Cheng, Zuoguang Liu, Heng Wu, Peng Xu 2020-02-11
10381262 Fabrication of vertical transport fin field effect transistors with a self-aligned separator and an isolation region with an air gap Kangguo Cheng, Zuoguang Liu, Heng Wu, Peng Xu 2019-08-13
10361364 Co-fabrication of magnetic device structures with electrical interconnects having reduced resistance through increased conductor grain size Lawrence A. Clevenger, Liying Jiang, Michael Rizzolo, Chih-Chao Yang 2019-07-23
10312132 Forming sacrificial endpoint layer for deep STI recess Kangguo Cheng, Juntao Li, Peng Xu 2019-06-04
10056289 Fabrication of vertical transport fin field effect transistors with a self-aligned separator and an isolation region with an air gap Kangguo Cheng, Zuoguang Liu, Heng Wu, Peng Xu 2018-08-21
9768262 Embedded carbon-doped germanium as stressor for germanium nFET devices Jeffrey L. Dittmar, Keith E. Fogel, Alexander Reznicek, Devendra K. Sadana 2017-09-19
9419138 Embedded carbon-doped germanium as stressor for germanium nFET devices Jeffrey L. Dittmar, Keith E. Fogel, Alexander Reznicek, Devendra K. Sadana 2016-08-16
9305883 Locally raised epitaxy for improved contact by local silicon capping during trench silicide processings Vamsi K. Paruchuri, Alexander Reznicek, Dominic J. Schepis 2016-04-05
9231061 Fabrication of surface textures by ion implantation for antireflection of silicon crystals Mengbing Huang, Nirag Kadakia, Hassaram Bakhru 2016-01-05
8999779 Locally raised epitaxy for improved contact by local silicon capping during trench silicide processings Vamsi K. Paruchuri, Alexander Reznicek, Dominic J. Schepis 2015-04-07
8900934 FinFET devices containing merged epitaxial Fin-containing contact regions Thomas N. Adam, Veeraraghavan S. Basker, Jinghong Li, Chung-Hsun Lin, Alexander Reznicek +1 more 2014-12-02
8896063 FinFET devices containing merged epitaxial Fin-containing contact regions Thomas N. Adam, Veeraraghavan S. Basker, Jinghong Li, Chung-Hsun Lin, Alexander Reznicek +1 more 2014-11-25