Issued Patents All Time
Showing 1–25 of 49 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9620481 | Substrate bonding with diffusion barrier structures | Daniel C. Edelstein, Douglas C. La Tulipe, Jr., Wei Lin, Deepika Priyadarshini, Spyridon Skordas +1 more | 2017-04-11 |
| 9564386 | Semiconductor package with structures for cooling fluid retention | Wei Lin, Son V. Nguyen, Spyridon Skordas | 2017-02-07 |
| 9502288 | Method of forming an interconnect structure | Son V. Nguyen, Alfred Grill, Thomas J. Haigh, Jr., Hosadurga Shobha | 2016-11-22 |
| 9472457 | Manganese oxide hard mask for etching dielectric materials | Wei Lin, Spyridon Skordas | 2016-10-18 |
| 9412629 | Wafer bonding for 3D device packaging fabrication | Son V. Nguyen, Vamsi K. Paruchuri, Deepika Priyadarshini | 2016-08-09 |
| 9263366 | Liquid cooling of semiconductor chips utilizing small scale structures | Wei Lin, Son V. Nguyen, Spyridon Skordas | 2016-02-16 |
| 9142488 | Manganese oxide hard mask for etching dielectric materials | Wei Lin, Spyridon Skordas | 2015-09-22 |
| 9087876 | Titanium oxynitride hard mask for lithographic patterning | Son V. Nguyen, Christopher J. Waskiewicz | 2015-07-21 |
| 9064937 | Substrate bonding with diffusion barrier structures | Daniel C. Edelstein, Douglas C. La Tulipe, Jr., Wei Lin, Deepika Priyadarshini, Spyridon Skordas +1 more | 2015-06-23 |
| 9058974 | Distorting donor wafer to corresponding distortion of host wafer | Wei Lin, Spyridon Skordas | 2015-06-16 |
| 9053926 | Cyclical physical vapor deposition of dielectric layers | Paul C. Jamison, Juntao Li, Vamsi K. Paruchuri, Takaaki Tsunoda, Sanjay Shinde | 2015-06-09 |
| 9054109 | Corrosion/etching protection in integration circuit fabrications | Wei Lin, Son V. Nguyen, Vamsi K. Paruchuri | 2015-06-09 |
| 9028628 | Wafer-to-wafer oxide fusion bonding | Wei Lin, Deepika Priyadarshini, Spyridon Skordas | 2015-05-12 |
| 8987133 | Titanium oxynitride hard mask for lithographic patterning | Son V. Nguyen, Christopher J. Waskiewicz | 2015-03-24 |
| 8986921 | Lithographic material stack including a metal-compound hard mask | Daniel C. Edelstein, Bryan G. Morris, Christopher J. Waskiewicz, Yunpeng Yin | 2015-03-24 |
| 8975922 | Method and apparatus for simultaneous processing of multiple functions | Adrian Stoica, Radu Andrei, David Zhu, Mohammad M. Mojarradi | 2015-03-10 |
| 8853095 | Hybrid hard mask for damascene and dual damascene | James J. Kelly | 2014-10-07 |
| 8765578 | Edge protection of bonded wafers during wafer thinning | Douglas C. La Tulipe, Jr., Spyridon Skordas, Kevin R. Winstel | 2014-07-01 |
| 8698318 | Superfilled metal contact vias for semiconductor devices | James J. Kelly, Veeraraghavan S. Basker, Balasubramanian S. Pranatharthi Haran, Soon-Cheon Seo | 2014-04-15 |
| 8691687 | Superfilled metal contact vias for semiconductor devices | James J. Kelly, Veeraghavan S. Basker, Bala Haran, Soon-Cheon Seo | 2014-04-08 |
| 8299365 | Self-aligned composite M-MOx/dielectric cap for Cu interconnect structures | Son V. Nguyen, Alfred Grill, Thomas J. Haigh, Jr., Hosadurga Shobha | 2012-10-30 |
| 6416158 | Ballistic aerosol marking apparatus with stacked electrode structure | Philip D. Floyd, Kaiser H. Wong, Gregory B. Anderson, Eric Peeters, Jaan Noolandi +5 more | 2002-07-09 |
| 6328436 | Electro-static particulate source, circulation, and valving system for ballistic aerosol marking | Philip D. Floyd, David K. Biegelsen, Eric Peeters, Frederick J. Endicott, Richard P. N. Veregin +7 more | 2001-12-11 |
| 6293659 | Particulate source, circulation, and valving system for ballistic aerosol marking | Philip D. Floyd, David K. Biegelsen, Eric Peeters, Frederick J. Endicott, Richard P. N. Veregin +7 more | 2001-09-25 |
| 6290342 | Particulate marking material transport apparatus utilizing traveling electrostatic waves | Dan A. Hays, Eric Peeters, Abdul M. Elhatem, Kaiser H. Wong, Joel A. Kubby +1 more | 2001-09-18 |