Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12224203 | Air gap spacer formation for nano-scale semiconductor devices | Kangguo Cheng, Juntao Li, Eric G. Liniger, Sanjay C. Mehta, Son V. Nguyen +2 more | 2025-02-11 |
| 11791398 | Nano multilayer carbon-rich low-k spacer | Donald F. Canaperi, Richard A. Conti, Eric R. Miller, Son V. Nguyen | 2023-10-17 |
| 11756786 | Forming high carbon content flowable dielectric film with low processing damage | Benjamin D. Briggs, Donald F. Canaperi, Huy Cao, Son V. Nguyen, Hosadurga Shobha +2 more | 2023-09-12 |
| 11658062 | Air gap spacer formation for nano-scale semiconductor devices | Kangguo Cheng, Juntao Li, Eric G. Liniger, Sanjay C. Mehta, Son V. Nguyen +2 more | 2023-05-23 |
| 11171054 | Selective deposition with SAM for fully aligned via | Son V. Nguyen, Rudy J. Wojtecki, Noel Arellano, Alexander Edward Hess, Cornelius Brown Peethala +1 more | 2021-11-09 |
| 11164776 | Metallic interconnect structure | Son V. Nguyen, Takeshi Nogami, Cornelius Brown Peethala, Matthew T. Shoudy | 2021-11-02 |
| 10937892 | Nano multilayer carbon-rich low-k spacer | Donald F. Canaperi, Richard A. Conti, Eric R. Miller, Son V. Nguyen | 2021-03-02 |
| 10418277 | Air gap spacer formation for nano-scale semiconductor devices | Kangguo Cheng, Juntao Li, Eric G. Liniger, Sanjay C. Mehta, Son V. Nguyen +2 more | 2019-09-17 |
| 10242865 | Robust high performance low hydrogen silicon carbon nitride (SiCNH) dielectrics for nano electronic devices | Son V. Nguyen, Deepika Priyadarshini, Hosadurga Shobha | 2019-03-26 |
| 10236176 | Robust high performance low hydrogen silicon carbon nitride (SiCNH) dielectrics for nano electronic devices | Son V. Nguyen, Deepika Priyadarshini, Hosadurga Shobha | 2019-03-19 |
| 10115629 | Air gap spacer formation for nano-scale semiconductor devices | Kangguo Cheng, Juntao Li, Eric G. Liniger, Sanjay C. Mehta, Son V. Nguyen +2 more | 2018-10-30 |
| 9892961 | Air gap spacer formation for nano-scale semiconductor devices | Kangguo Cheng, Juntao Li, Eric G. Liniger, Sanjay C. Mehta, Son V. Nguyen +2 more | 2018-02-13 |
| 9735005 | Robust high performance low hydrogen silicon carbon nitride (SiCNH) dielectrics for nano electronic devices | Son V. Nguyen, Deepika Priyadarshini, Hosadurga Shobha | 2017-08-15 |
| 9502288 | Method of forming an interconnect structure | Son V. Nguyen, Alfred Grill, Hosadurga Shobha, Tuan A. Vo | 2016-11-22 |
| 9312224 | Interconnect structure containing a porous low k interconnect dielectric/dielectric cap | Donald F. Canaperi, Alfred Grill, Son V. Nguyen, Takeshi Nogami, Deepika Priyadarshini +2 more | 2016-04-12 |
| 9105642 | Interlevel dielectric stack for interconnect structures | Griselda Bonilla, Alfred Grill, Satyanarayana V. Nitta, Son V. Nguyen | 2015-08-11 |
| 9018767 | Interlevel dielectric stack for interconnect structures | Griselda Bonilla, Alfred Grill, Satyanarayana V. Nitta, Son V. Nguyen | 2015-04-28 |
| 8779600 | Interlevel dielectric stack for interconnect structures | Son V. Nguyen, Griselda Bonilla, Alfred Grill, Satyanarayana V. Nitta | 2014-07-15 |
| 8652950 | C-rich carbon boron nitride dielectric films for use in electronic devices | Son V. Nguyen, Alfred Grill, Sanjay C. Mehta | 2014-02-18 |
| 8637412 | Process to form an adhesion layer and multiphase ultra-low k dielectric material using PECVD | Alfred Grill, Kelly Malone, Son V. Nguyen, Vishnubhai V. Patel, Hosadurga Shobha | 2014-01-28 |
| 8536069 | Multilayered low k cap with conformal gap fill and UV stable compressive stress properties | Mihaela Balseanu, Stephan A. Cohen, Alfred Grill, Son V. Nguyen, Li-Qun Xia | 2013-09-17 |
| 8492880 | Multilayered low k cap with conformal gap fill and UV stable compressive stress properties | Mihaela Balseanu, Stephan A. Cohen, Alfred Grill, Son V. Nguyen, Li-Qun Xia | 2013-07-23 |
| 8476743 | C-rich carbon boron nitride dielectric films for use in electronic devices | Son V. Nguyen, Alfred Grill, Sanjay C. Mehta | 2013-07-02 |
| 8362596 | Engineered interconnect dielectric caps having compressive stress and interconnect structures containing same | Stephan A. Cohen, Alfred Grill, Xiao Hu Liu, Son V. Nguyen, Thomas M. Shaw +1 more | 2013-01-29 |
| 8299365 | Self-aligned composite M-MOx/dielectric cap for Cu interconnect structures | Son V. Nguyen, Alfred Grill, Hosadurga Shobha, Tuan A. Vo | 2012-10-30 |