Issued Patents All Time
Showing 25 most recent of 72 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431361 | Self-aligned double patterning with spatial atomic layer deposition | Ning Li, Victor Nguyen, Li-Qun Xia, Keiichi Tanaka, Steven Marcus | 2025-09-30 |
| 12362169 | Methods and apparatus for low temperature silicon nitride films | Wenbo Yan, Cong Trinh, Ning Li, Li-Qun Xia, Maribel Maldonado-Garcia | 2025-07-15 |
| 12334394 | Methods and apparatus for selective etch stop capping and selective via open for fully landed via on underlying metal | Suketu Arun Parikh, Bhaskar Jyoti Bhuyan, Ning Li, Mark Saly, Aaron Dangerfield +2 more | 2025-06-17 |
| 12195851 | Thin layer deposition with plasma pulsing | Cong Trinh, Maribel Maldonado-Garcia, Alexander V. Garachtchenko, Tsutomu Tanaka | 2025-01-14 |
| 12142475 | Sequential plasma and thermal treatment | Ning Li, Shuaidi Zhang, Qi Gao, Rajesh Prasad, Tomohiko Kitajima +3 more | 2024-11-12 |
| 11990332 | Methods and apparatus for deposition of low-k films | Bhaskar Jyoti Bhuyan, Mark Saly, Zhelin Sun, Ning Li, Li-Qun Xia +2 more | 2024-05-21 |
| 11970777 | Deposition of low-k films | Shuaidi Zhang, Ning Li, Bhaskar Jyoti Bhuyan, Mark Saly, Thomas Knisley | 2024-04-30 |
| 11932940 | Silyl pseudohalides for silicon containing films | Keenan N. Woods, Cong Trinh, Mark Saly, Maribel Maldonado-Garcia, Lisa J. Enman | 2024-03-19 |
| 11930637 | Confined charge trap layer | Chang-Seok Kang, Tomohiko Kitajima | 2024-03-12 |
| 11887847 | Methods and precursors for selective deposition of metal films | Kurt Fredrickson, Atashi Basu, Ning Li | 2024-01-30 |
| 11887818 | Methods and systems to modulate film stress | Tsutomu Tanaka, John C. Forster, Ran Liu, Kenichi Ohno, Ning Li +2 more | 2024-01-30 |
| 11800824 | Low temperature silicon nitride/silicon oxynitride stack film with tunable dielectric constant | Maribel Maldonado-Garcia, Cong Trinh | 2023-10-24 |
| 11732356 | Multilayer encapsulation stacks by atomic layer deposition | Cong Trinh, Maribel Maldonado-Garcia, Ning Li, Mark Saly, Bhaskar Jyoti Bhuyan +2 more | 2023-08-22 |
| 11713507 | Low-k films | Shuaidi Zhang, Ning Li | 2023-08-01 |
| 11692267 | Plasma induced modification of silicon carbide surface | Francis Kanyiri Mungai, Vijayabhaskara Venkatagiriyappa, Yung-Cheng Hsu, Keiichi Tanaka, Mario David Silvetti | 2023-07-04 |
| 11581213 | Susceptor wafer chucks for bowed wafers | Abhishek Chowdhury, Vijayabhaskara Venkatagiriyappa, Jyoti Prakash Deo, Srinivas Ramakrishna, Keiichi Tanaka +4 more | 2023-02-14 |
| 11515151 | Methods and precursors for selective deposition of metal films | Kurt Fredrickson, Atashi Basu, Ning Li | 2022-11-29 |
| 11447865 | Deposition of low-κ films | Shuaidi Zhang, Ning Li, Bhaskar Jyoti Bhuyan, Mark Saly, Thomas Knisley | 2022-09-20 |
| 11371144 | Low-k films | Shuaidi Zhang, Ning Li | 2022-06-28 |
| 11359281 | Selective deposition of SiCON by plasma ALD | Shuaidi Zhang, Ning Li | 2022-06-14 |
| 11270914 | Method of forming self-aligned via | Suketu Arun Parikh | 2022-03-08 |
| 11217443 | Sequential deposition and high frequency plasma treatment of deposited film on patterned and un-patterned substrates | Vinayak Veer Vats, Hang Yu, Philip Allan Kraus, Sanjay Kamath, William J. Durand +6 more | 2022-01-04 |
| 11164753 | Self-aligned double patterning with spatial atomic layer deposition | Ning Li, Victor Nguyen, Li-Qun Xia, Keiichi Tanaka, Steven Marcus | 2021-11-02 |
| 11158489 | Methods and systems to modulate film stress | Tsutomu Tanaka, John C. Forster, Ran Liu, Kenichi Ohno, Ning Li +2 more | 2021-10-26 |
| 11133178 | Seamless gapfill with dielectric ALD films | Ning Li | 2021-09-28 |