Issued Patents All Time
Showing 51–72 of 72 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8536069 | Multilayered low k cap with conformal gap fill and UV stable compressive stress properties | Stephan A. Cohen, Alfred Grill, Thomas J. Haigh, Jr., Son V. Nguyen, Li-Qun Xia | 2013-09-17 |
| 8501568 | Method of forming flash memory with ultraviolet treatment | Vladimir Zubkov, Li-Qun Xia, Atif Noori, Reza Arghavani, Derek R. Witty +1 more | 2013-08-06 |
| 8492880 | Multilayered low k cap with conformal gap fill and UV stable compressive stress properties | Stephan A. Cohen, Alfred Grill, Thomas J. Haigh, Jr., Son V. Nguyen, Li-Qun Xia | 2013-07-23 |
| 8337950 | Method for depositing boron-rich films for lithographic mask applications | Victor Nguyen, Yi-Hsing Chen, Isabelita Roflox, Li-Qun Xia, Derek R. Witty | 2012-12-25 |
| 8252653 | Method of forming a non-volatile memory having a silicon nitride charge trap layer | Vladimir Zubkov, Li-Qun Xia, Atif Noori, Reza Arghavani, Derek R. Witty +1 more | 2012-08-28 |
| 8148269 | Boron nitride and boron-nitride derived materials deposition method | Christopher Dennis Bencher, Yongmei Chen, Li Yan Miao, Victor Nguyen, Isabelita Roflox +2 more | 2012-04-03 |
| 8138104 | Method to increase silicon nitride tensile stress using nitrogen plasma in-situ treatment and ex-situ UV cure | Victor Nguyen, Li-Qun Xia, Derek R. Witty, Hichem M'Saad, Mei-Yee Shek +1 more | 2012-03-20 |
| 8129290 | Method to increase tensile stress of silicon nitride films using a post PECVD deposition UV cure | Michael S. Cox, Li-Qun Xia, Mei-Yee Shek, Jia-Sheng Lee, Vladimir Zubkov +4 more | 2012-03-06 |
| 8084105 | Method of depositing boron nitride and boron nitride-derived materials | Jeong-Uk Huh, Li-Qun Xia, Victor Nguyen, Derek R. Witty, Hichem M'Saad | 2011-12-27 |
| 7923386 | Method to improve the step coverage and pattern loading for dielectric films | Mei-Yee Shek, Li-Qun Xia, Hichem M'Saad | 2011-04-12 |
| 7910491 | Gapfill improvement with low etch rate dielectric liners | Young Soo Kwon, Bi Jang, Anchuan Wang, Young S. Lee, Li-Qun Xia +1 more | 2011-03-22 |
| 7879683 | Methods and apparatus of creating airgap in dielectric layers for the reduction of RC delay | Amir Al-Bayati, Alexandros T. Demos, Kang Sub Yim, Mehul Naik, Zhenjiang Cui +2 more | 2011-02-01 |
| 7871926 | Methods and systems for forming at least one dielectric layer | Li-Qun Xia, Victor Nguyen, Derek R. Witty, Hichem M'Saad, Haichun Yang +3 more | 2011-01-18 |
| 7816205 | Method of forming non-volatile memory having charge trap layer with compositional gradient | Vladimir Zubkov, Li-Qun Xia, Atif Noori, Reza Arghavani, Derek R. Witty +1 more | 2010-10-19 |
| 7790635 | Method to increase the compressive stress of PECVD dielectric films | Victor Nguyen, Li-Qun Xia, Vladimir Zubkov, Derek R. Witty, Hichem M'Saad | 2010-09-07 |
| 7780865 | Method to improve the step coverage and pattern loading for dielectric films | Li-Qun Xia, Mei-Yee Shek, Hichem M'Saad | 2010-08-24 |
| 7732342 | Method to increase the compressive stress of PECVD silicon nitride films | Li-Qun Xia, Vladimir Zubkov, Mei-Yee Shek, Isabelita Rolfox, Hichem M'Saad | 2010-06-08 |
| 7704816 | Boron derived materials deposition method | Jeong-Uk Huh, Li-Qun Xia, Derek R. Witty, Hichem M'Saad | 2010-04-27 |
| 7615788 | Method for monolithically integrating silicon carbide microelectromechanical devices with electronic circuitry | Kevin Kornegay, Andrew R. Atwell, Jon Sweat Duster, Eskinder Hailu, Ce Li | 2009-11-10 |
| 7601651 | Method to improve the step coverage and pattern loading for dielectric films | Meiyee Shek, Li-Qun Xia, Hichem M'Saad | 2009-10-13 |
| 7566655 | Integration process for fabricating stressed transistor structure | Jia-Sheng Lee, Mei-Yee Shek, Amir Al-Bayati, Li-Qun Xia, Hichem M'Saad | 2009-07-28 |
| 7170141 | Method for monolithically integrating silicon carbide microelectromechanical devices with electronic circuitry | Kevin Kornegay, Andrew R. Atwell, Jon Sweat Duster, Eskinder Hailu, Ce Li | 2007-01-30 |