KY

Kang Sub Yim

Applied Materials: 44 patents #196 of 7,310Top 3%
IBM: 1 patents #44,794 of 70,183Top 65%
Overall (All Time): #66,226 of 4,157,543Top 2%
44
Patents All Time

Issued Patents All Time

Showing 25 most recent of 44 patents

Patent #TitleCo-InventorsDate
12198925 Systems and methods for depositing low-k dielectric films Shaunak Mukherjee, Deenesh Padhi, Abhijit A. Kangude, Rahul Rajeev, Shubham Chowdhuri 2025-01-14
12119223 Single precursor low-k film deposition and UV cure for advanced technology node Bo Xie, Ruitong Xiong, Sure Ngo, Yijun Liu, Li-Qun Xia 2024-10-15
11967498 Systems and methods for depositing low-k dielectric films Bo Xie, Yijun Liu, Li-Qun Xia, Ruitong Xiong 2024-04-23
11621162 Systems and methods for forming UV-cured low-κ dielectric films Bo Xie, Ruitong Xiong, Sure Ngo, Yijun Liu, Li-Qun Xia 2023-04-04
11600486 Systems and methods for depositing low-κdielectric films Bo Xie, Ruitong Xiong, Sure Ngo, Yijun Liu, Li-Qun Xia 2023-03-07
11594409 Systems and methods for depositing low-k dielectric films Shaunak Mukherjee, Deenesh Padhi, Abhijit A. Kangude, Rahul Rajeev, Shubham Chowdhuri 2023-02-28
11572622 Systems and methods for cleaning low-k deposition chambers Bo Xie, Ruitong Xiong, Yijun Liu, Li-Qun Xia, Sure Ngo 2023-02-07
11393678 Low-k dielectric films William J. Durand, Mark Saly, Lakmal C. Kalutarage, Shaunak Mukherjee 2022-07-19
11289369 Low-k dielectric with self-forming barrier layer Yi Ding, Shaunak Mukherjee, Bo Xie, Deenesh Padhi 2022-03-29
10553427 Low dielectric constant oxide and low resistance OP stack for 3D NAND application Xinhai Han, Zhijun Jiang, Deenesh Padhi 2020-02-04
10113234 UV assisted silylation for porous low-k film sealing Bo Xie, Alexandros T. Demos, Vu Ngoc Tran Nguyen, Kelvin Chan, He Ren +1 more 2018-10-30
9850574 Forming a low-k dielectric layer with reduced dielectric constant and strengthened mechanical properties Taewan Kim, Alexandros T. Demos 2017-12-26
9659765 Enhancement of modulus and hardness for UV-cured ultra low-k dielectric films Mahendra CHHABRA, Kelvin Chan, Alexandros T. Demos, Priyanka DASH 2017-05-23
9478460 Cobalt selectivity improvement in selective cobalt process sequence Mei-Yee Shek, Weifeng YE, Li-Qun Xia, Kelvin Chan 2016-10-25
9391024 Multi-layer dielectric stack for plasma damage protection Bo Xie, Cheng Pan, Sure Ngo, Taewan Kim, Alexandros T. Demos 2016-07-12
9324571 Post treatment for dielectric constant reduction with pore generation on low K dielectric films Pendar Ardalan, Sure Ngo, Alexandros T. Demos 2016-04-26
9312167 Air-gap structure formation with ultra low-k dielectric layer on PECVD low-k chamber Taewan Kim, Alexandros T. Demos 2016-04-12
9165998 Adhesion layer to minimize dielectric constant increase with good adhesion strength in a PECVD process Pendar Ardalan, Sure Ngo, Alexandros T. Demos 2015-10-20
9105695 Cobalt selectivity improvement in selective cobalt process sequence Mei-Yee Shek, Weifeng YE, Li-Qun Xia, Kelvin Chan 2015-08-11
8993444 Method to reduce dielectric constant of a porous low-k film Kelvin Chan, Jin Xu, Alexandros T. Demos 2015-03-31
8492170 UV assisted silylation for recovery and pore sealing of damaged low K films Bo Xie, Alexandros T. Demos, Thomas Nowak, Kelvin Chan 2013-07-23
8481422 Prevention and reduction of solvent and solution penetration into porous dielectrics using a thin barrier layer Kelvin Chan, Khaled A. Elsheref, Alexandros T. Demos, Mei-Yee Shek, Lipan Li +1 more 2013-07-09
8349746 Microelectronic structure including a low k dielectric and a method of controlling carbon distribution in the structure Bo Xie, Alexandros T. Demos, Daemian Raj, Sure Ngo 2013-01-08
8236684 Prevention and reduction of solvent and solution penetration into porous dielectrics using a thin barrier layer Kelvin Chan, Khaled A. Elsheref, Alexandros T. Demos, Meiyee Shek, Lipan Li +1 more 2012-08-07
8216861 Dielectric recovery of plasma damaged low-k films by UV-assisted photochemical deposition Thomas Nowak, Bo Xie, Alexandros T. Demos 2012-07-10