| 12422210 |
Techniques and device structures based upon directional dielectric deposition and bottom-up fill |
M. Arif Zeeshan, Tristan Y. Ma |
2025-09-23 |
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| 12406837 |
Reaction cell for species sensing |
Abdullah Zafar, Philip Allan Kraus |
2025-09-02 |
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| 12394670 |
Nucleation-free gap fill ALD process |
Yihong Chen, Xinliang Lu, Srinivas Gandikota, Yong Wu, Susmit Singha Roy +1 more |
2025-08-19 |
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| 12368024 |
Methods and apparatus for processing a substrate |
Abdullah Zafar, William J. Durand, Xinyuan Chong, Kenric Choi, Weize Hu +4 more |
2025-07-22 |
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| 12325910 |
Deposition of conformal and gap-fill amorphous silicon thin-films |
Yihong Chen, Rui Cheng, Pramit Manna, Karthik Janakiraman, Abhijit Basu Mallick +1 more |
2025-06-10 |
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| 12300491 |
Deposition of semiconductor integration films |
Lakmal C. Kalutarage, Mark Saly, Bhaskar Jyoti Bhuyan, Thomas Knisley, Regina Freed +3 more |
2025-05-13 |
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| 12282256 |
Photoresist deposition using independent multichannel showerhead |
Farzad Houshmand, Wayne French, Anantha K. Subramani, Lakmal C. Kalutarage, Mark Saly |
2025-04-22 |
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| 12228534 |
Capacitive sensor for monitoring gas concentration |
Xiaopu Li, Kallol Bera, Yaoling Pan, Amir Bayati, Philip Allan Kraus +2 more |
2025-02-18 |
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| 12131948 |
Techniques for void-free material depositions |
M. Arif Zeeshan, Shantanu Kallakuri, Sony Varghese, John Hautala |
2024-10-29 |
$69,228,000 |
| 12094707 |
Plasma enhanced CVD with periodic high voltage bias |
Travis Koh, Simon Huang, Philip Allan Kraus |
2024-09-17 |
$46,375,000 |
| 12012652 |
Single process volume to perform high-pressure and low-pressure processes with features to reduce cross-contamination |
Yang Guo, Ashish Goel, Anantha K. Subramani, Philip Allan Kraus |
2024-06-18 |
$83,264,000 |
| 11959868 |
Capacitive sensor for monitoring gas concentration |
Xiaopu Li, Kallol Bera, Yaoling Pan, Amir Bayati, Philip Allan Kraus +2 more |
2024-04-16 |
$82,852,000 |
| 11956978 |
Techniques and device structure based upon directional seeding and selective deposition |
M. Arif Zeeshan, Shantanu Kallakuri, Sony Varghese |
2024-04-09 |
$47,694,000 |
| 11955331 |
Method of forming silicon nitride films using microwave plasma |
Hanhong Chen, Philip Allan Kraus, Thai Cheng Chua |
2024-04-09 |
$47,694,000 |
| 11887856 |
Enhanced spatial ALD of metals through controlled precursor mixing |
Yihong Chen, Jared Ahmad Lee, Kevin Griffin, Srinivas Gandikota, Joseph Yudovsky +1 more |
2024-01-30 |
$39,141,000 |
| 11886120 |
Deposition of semiconductor integration films |
Lakmal C. Kalutarage, Mark Saly, Bhaskar Jyoti Bhuyan, Thomas Knisley, Regina Freed +3 more |
2024-01-30 |
$39,141,000 |
| 11817320 |
CVD based oxide-metal multi structure for 3D NAND memory devices |
Susmit Singha Roy, Hien Minh Le, Sanjay Kamath, Abhijit Basu Mallick, Srinivas Gandikota +1 more |
2023-11-14 |
$33,075,000 |
| 11776805 |
Selective oxidation and simplified pre-clean |
Bencherki Mebarki, Joung Joo Lee, Yi Xu, Yu Lei, Xianmin Tang +2 more |
2023-10-03 |
$34,462,000 |
| 11749564 |
Techniques for void-free material depositions |
M. Arif Zeeshan, Shantanu Kallakuri, Sony Varghese, John Hautala |
2023-09-05 |
$42,922,000 |
| 11702742 |
Methods of forming nucleation layers with halogenated silanes |
Yihong Chen |
2023-07-18 |
$58,990,000 |
| 11621160 |
Doped and undoped vanadium oxides for low-k spacer applications |
Eswaranand Venkatasubramanian, Srinivas Gandikota, Atashi Basu, Abhijit Basu Mallick |
2023-04-04 |
$41,324,000 |
| 11562904 |
Deposition of semiconductor integration films |
Lakmal C. Kalutarage, Mark Saly, Bhaskar Jyoti Bhuyan, Thomas Knisley, Regina Freed +3 more |
2023-01-24 |
$45,726,000 |
| 11562902 |
Hydrogen management in plasma deposited films |
Rui Cheng, Diwakar Kedlaya, Karthik Janakiraman, Gautam K. Hemani, Krishna Nittala +4 more |
2023-01-24 |
$45,726,000 |
| 11551905 |
Resonant process monitor |
Yaoling Pan, Vijaykumar Krithivasan, Shimin Mao, Michael D. Willwerth, Anantha K. Subramani +5 more |
2023-01-10 |
$14,061,000 |
| 11459652 |
Techniques and device structures based upon directional dielectric deposition and bottom-up fill |
M. Arif Zeeshan, Tristan Y. Ma |
2022-10-04 |
$41,370,000 |
