Issued Patents All Time
Showing 25 most recent of 38 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12228534 | Capacitive sensor for monitoring gas concentration | Xiaopu Li, Kallol Bera, Kelvin Chan, Amir Bayati, Philip Allan Kraus +2 more | 2025-02-18 |
| 12163911 | Capacitive sensor housing for chamber condition monitoring | Patrick Tae, Leonard Tedeschi, Michael D. Willwerth, Daniel T. McCormick | 2024-12-10 |
| 12123090 | Differential capacitive sensor for in-situ film thickness and dielectric constant measurement | Patrick Tae, Leonard Tedeschi | 2024-10-22 |
| 12006209 | MEMS and NEMS structures | John H. Hong, Tallis Young Chang, Edward Chan, Bing Wen, Sean ANDREWS | 2024-06-11 |
| 12009236 | Sensors and system for in-situ edge ring erosion monitor | Patrick Tae, Michael D. Willwerth, Leonard Tedeschi, Daniel Sang Byun, Philip Allan Kraus +5 more | 2024-06-11 |
| 11959868 | Capacitive sensor for monitoring gas concentration | Xiaopu Li, Kallol Bera, Kelvin Chan, Amir Bayati, Philip Allan Kraus +2 more | 2024-04-16 |
| 11781214 | Differential capacitive sensors for in-situ film thickness and dielectric constant measurement | Patrick Tae, Leonard Tedeschi | 2023-10-10 |
| 11685649 | Capping plate for panel scale packaging of MEMS products | John H. Hong, Tallis Young Chang, Edward Chan, Bing Wen, Kenji Nomura | 2023-06-27 |
| 11581206 | Capacitive sensor for chamber condition monitoring | Patrick Tae, Leonard Tedeschi, Jennifer Y. Sun, Philip Allan Kraus, Xiaopu Li +6 more | 2023-02-14 |
| 11551905 | Resonant process monitor | Vijaykumar Krithivasan, Shimin Mao, Kelvin Chan, Michael D. Willwerth, Anantha K. Subramani +5 more | 2023-01-10 |
| 11545346 | Capacitive sensing data integration for plasma chamber condition monitoring | Patrick Tae, Michael D. Willwerth, Leonard Tedeschi, Kiyki-Shiy Shang, Mikhail Taraboukhine +2 more | 2023-01-03 |
| 11415538 | Capacitive sensor housing for chamber condition monitoring | Patrick Tae, Leonard Tedeschi, Michael D. Willwerth, Daniel T. McCormick | 2022-08-16 |
| 11282760 | Integrated packaging devices and methods with backside interconnections | Tallis Young Chang, John H. Hong | 2022-03-22 |
| 10453766 | Integrated packaging devices and methods with backside interconnections | Tallis Young Chang, John H. Hong | 2019-10-22 |
| 10150667 | Panel level packaging for MEMS application | Omar J. Bchir | 2018-12-11 |
| 10131534 | Stacked vias for vertical integration | Lixia Zhou | 2018-11-20 |
| 9715156 | Interferometric modulator mirror design without metal layer in the hinge | Tallis Young Chang, Bing Wen, Edward Chan | 2017-07-25 |
| 9477076 | EMS device having flexible support posts | John H. Hong, Jian Ma, Bing Wen, Tallis Young Chang, Edward Chan +3 more | 2016-10-25 |
| 8817358 | Thin film stack with surface-conditioning buffer layers and related methods | John H. Hong, Isak Clark Reines, Chong U. Lee, Tallis Young Chang, Edward Chan | 2014-08-26 |
| 8797303 | Amorphous oxide semiconductor thin film transistor fabrication method | Cheonhong Kim, John H. Hong | 2014-08-05 |
| 7951422 | Methods for oriented growth of nanowires on patterned substrates | Xiangfeng Duan, Robert S. Dubrow, Jay L. Goldman, Shahriar Mostarshed, Chunming Niu +5 more | 2011-05-31 |
| 7871870 | Method of fabricating gate configurations for an improved contacts in nanowire based electronic devices | Shahriar Mostarshed, Jian Chen, Francisco Leon, Linda Romano | 2011-01-18 |
| 7795125 | System and process for producing nanowire composites and electronic substrates therefrom | Mihai Buretea, Jian Chen, Calvin Y. H. Chow, Chunming Niu, J. Wallace Parce +2 more | 2010-09-14 |
| 7786024 | Selective processing of semiconductor nanowires by polarized visible radiation | David Stumbo, Costas P. Grigoropoulos, Nipun Misra | 2010-08-31 |
| 7741197 | Systems and methods for harvesting and reducing contamination in nanowires | Xiangfeng Duan, Paul Bernatis, Alice Fischer-Colbrie, James M. Hamilton, Francesco Lemmi +3 more | 2010-06-22 |