| 12228534 |
Capacitive sensor for monitoring gas concentration |
Xiaopu Li, Kallol Bera, Kelvin Chan, Amir Bayati, Philip Allan Kraus +2 more |
2025-02-18 |
|
| 12163911 |
Capacitive sensor housing for chamber condition monitoring |
Patrick Tae, Leonard Tedeschi, Michael D. Willwerth, Daniel T. McCormick |
2024-12-10 |
$69,596,000 |
| 12123090 |
Differential capacitive sensor for in-situ film thickness and dielectric constant measurement |
Patrick Tae, Leonard Tedeschi |
2024-10-22 |
$83,950,000 |
| 12006209 |
MEMS and NEMS structures |
John H. Hong, Tallis Young Chang, Edward Chan, Bing Wen, Sean ANDREWS |
2024-06-11 |
|
| 12009236 |
Sensors and system for in-situ edge ring erosion monitor |
Patrick Tae, Michael D. Willwerth, Leonard Tedeschi, Daniel Sang Byun, Philip Allan Kraus +5 more |
2024-06-11 |
$84,570,000 |
| 11959868 |
Capacitive sensor for monitoring gas concentration |
Xiaopu Li, Kallol Bera, Kelvin Chan, Amir Bayati, Philip Allan Kraus +2 more |
2024-04-16 |
$82,852,000 |
| 11781214 |
Differential capacitive sensors for in-situ film thickness and dielectric constant measurement |
Patrick Tae, Leonard Tedeschi |
2023-10-10 |
$39,034,000 |
| 11685649 |
Capping plate for panel scale packaging of MEMS products |
John H. Hong, Tallis Young Chang, Edward Chan, Bing Wen, Kenji Nomura |
2023-06-27 |
|
| 11581206 |
Capacitive sensor for chamber condition monitoring |
Patrick Tae, Leonard Tedeschi, Jennifer Y. Sun, Philip Allan Kraus, Xiaopu Li +6 more |
2023-02-14 |
$35,617,000 |
| 11551905 |
Resonant process monitor |
Vijaykumar Krithivasan, Shimin Mao, Kelvin Chan, Michael D. Willwerth, Anantha K. Subramani +5 more |
2023-01-10 |
$14,061,000 |
| 11545346 |
Capacitive sensing data integration for plasma chamber condition monitoring |
Patrick Tae, Michael D. Willwerth, Leonard Tedeschi, Kiyki-Shiy Shang, Mikhail Taraboukhine +2 more |
2023-01-03 |
$39,123,000 |
| 11415538 |
Capacitive sensor housing for chamber condition monitoring |
Patrick Tae, Leonard Tedeschi, Michael D. Willwerth, Daniel T. McCormick |
2022-08-16 |
$38,686,000 |
| 11282760 |
Integrated packaging devices and methods with backside interconnections |
Tallis Young Chang, John H. Hong |
2022-03-22 |
|
| 10453766 |
Integrated packaging devices and methods with backside interconnections |
Tallis Young Chang, John H. Hong |
2019-10-22 |
|
| 10150667 |
Panel level packaging for MEMS application |
Omar J. Bchir |
2018-12-11 |
|
| 10131534 |
Stacked vias for vertical integration |
Lixia Zhou |
2018-11-20 |
$7,849,000 |
| 9715156 |
Interferometric modulator mirror design without metal layer in the hinge |
Tallis Young Chang, Bing Wen, Edward Chan |
2017-07-25 |
$12,472,000 |
| 9477076 |
EMS device having flexible support posts |
John H. Hong, Jian Ma, Bing Wen, Tallis Young Chang, Edward Chan +3 more |
2016-10-25 |
$14,056,000 |
| 8817358 |
Thin film stack with surface-conditioning buffer layers and related methods |
John H. Hong, Isak Clark Reines, Chong U. Lee, Tallis Young Chang, Edward Chan |
2014-08-26 |
$8,532,000 |
| 8797303 |
Amorphous oxide semiconductor thin film transistor fabrication method |
Cheonhong Kim, John H. Hong |
2014-08-05 |
$6,581,000 |
| 7951422 |
Methods for oriented growth of nanowires on patterned substrates |
Xiangfeng Duan, Robert S. Dubrow, Jay L. Goldman, Shahriar Mostarshed, Chunming Niu +5 more |
2011-05-31 |
|
| 7871870 |
Method of fabricating gate configurations for an improved contacts in nanowire based electronic devices |
Shahriar Mostarshed, Jian Chen, Francisco Leon, Linda Romano |
2011-01-18 |
|
| 7795125 |
System and process for producing nanowire composites and electronic substrates therefrom |
Mihai Buretea, Jian Chen, Calvin Y. H. Chow, Chunming Niu, J. Wallace Parce +2 more |
2010-09-14 |
|
| 7786024 |
Selective processing of semiconductor nanowires by polarized visible radiation |
David Stumbo, Costas P. Grigoropoulos, Nipun Misra |
2010-08-31 |
|
| 7741197 |
Systems and methods for harvesting and reducing contamination in nanowires |
Xiangfeng Duan, Paul Bernatis, Alice Fischer-Colbrie, James M. Hamilton, Francesco Lemmi +3 more |
2010-06-22 |
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