| 12163911 |
Capacitive sensor housing for chamber condition monitoring |
Yaoling Pan, Patrick Tae, Leonard Tedeschi, Michael D. Willwerth |
2024-12-10 |
| 11581206 |
Capacitive sensor for chamber condition monitoring |
Yaoling Pan, Patrick Tae, Leonard Tedeschi, Jennifer Y. Sun, Philip Allan Kraus +6 more |
2023-02-14 |
| 11415538 |
Capacitive sensor housing for chamber condition monitoring |
Yaoling Pan, Patrick Tae, Leonard Tedeschi, Michael D. Willwerth |
2022-08-16 |
| 11088000 |
Wafer based corrosion and time dependent chemical effects |
Leonard Tedeschi, Benjamin Schwarz, Changhun Lee, Ping Han Hsieh, Adauto Diaz |
2021-08-10 |
| 10923405 |
Wafer processing equipment having capacitive micro sensors |
Leonard Tedeschi, Kartik Ramaswamy, Robert Meagley |
2021-02-16 |
| 10712525 |
Packaging MEMS in fluidic environments |
Albert Ting, Michael Rattner |
2020-07-14 |
| 10515862 |
Wafer based corrosion and time dependent chemical effects |
Leonard Tedeschi, Benjamin Schwarz, Changhun Lee, Ping Han Hsieh, Adauto Diaz |
2019-12-24 |
| 10083883 |
Wafer processing equipment having capacitive micro sensors |
Leonard Tedeschi, Kartik Ramaswamy, Robert Meagley |
2018-09-25 |
| 9975758 |
Wafer processing equipment having exposable sensing layers |
Leonard Tedeschi, Lili Ji, Olivier Joubert, Dmitry Lubomirsky, Philip Allan Kraus |
2018-05-22 |
| 9725302 |
Wafer processing equipment having exposable sensing layers |
Leonard Tedeschi, Lili Ji, Olivier Joubert, Dmitry Lubomirsky, Philip Allan Kraus |
2017-08-08 |
| 9018724 |
Method of producing optical MEMS |
Albert Ting, Michael Rattner |
2015-04-28 |
