Capping plate for panel scale packaging of MEMS products

Assignee

• Obsidian Sensors

Inventors

• John H. Hong (91 patents)
• Tallis Young Chang (39 patents)
• Edward Chan (27 patents)
• Bing Wen (37 patents)
• Yaoling Pan (38 patents)
• Kenji Nomura (82 patents)

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