Issued Patents All Time
Showing 25 most recent of 60 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406884 | Self field-suppression CVD tungsten (W) fill on PVD W liner | Zhimin QI, Shirish A. PETHE, Xingyao GAO, Shiyu YUE, Aixi ZHANG +5 more | 2025-09-02 |
| D1089130 | Process chamber manifold | Geraldine VASQUEZ, Shreyas Patil Shanthaveeraswamy, Mehran Behdjat, Dien-Yeh Wu, Jallepally Ravi +3 more | 2025-08-19 |
| 12394619 | Metal oxide preclean for bottom-up gapfill in MEOL and BEOL | Shiyu YUE, Jiajie Cen, Sahil Patel, Zhimin QI, Ju Hyun OH +10 more | 2025-08-19 |
| 12374568 | One chamber multi-station selective metal removal | Shiyu YUE, Sahil Patel, Yu Lei, Wei Lei, Chih-Hsun Hsu +7 more | 2025-07-29 |
| 12272659 | Methods for forming metal gapfill with low resistivity | Yu Lei, Zhimin QI, Aixi ZHANG, Xianyuan ZHAO, Wei Lei +8 more | 2025-04-08 |
| 12230479 | Processing chamber with multiple plasma units | Kazuya Daito, Yu Lei, Takashi Kuratomi, Jallepally Ravi, Pingyan Lei +1 more | 2025-02-18 |
| 12191200 | Methods for minimizing feature-to-feature gap fill height variations | Jiajie Cen, Da He, Yu Lei | 2025-01-07 |
| 11967525 | Selective tungsten deposition at low temperatures | Yufei Hu, Yu Lei, Kazuya Daito, Da He, Jiajie Cen | 2024-04-23 |
| 11955381 | Low-temperature plasma pre-clean for selective gap fill | Yufei Hu, Kazuya Daito, Geraldine VASQUEZ, Da He, Jallepally Ravi +2 more | 2024-04-09 |
| 11955319 | Processing chamber with multiple plasma units | Kazuya Daito, Yu Lei, Takashi Kuratomi, Jallepally Ravi, Pingyan Lei +1 more | 2024-04-09 |
| 11948836 | Deposition of metal films with tungsten liner | Yu Lei, Sang-Hyeob Lee, Chris Pabelico, Tae Hong Ha, Xianmin Tang +1 more | 2024-04-02 |
| 11776806 | Multi-step pre-clean for selective metal gap fill | Xi Cen, Yakuan Yao, Yiming Lai, Kai Wu, Avgerinos V. Gelatos +8 more | 2023-10-03 |
| 11776805 | Selective oxidation and simplified pre-clean | Bencherki Mebarki, Joung Joo Lee, Yu Lei, Xianmin Tang, Kelvin Chan +2 more | 2023-10-03 |
| 11721542 | Dual plasma pre-clean for selective gap fill | Yufei Hu, Kazuya Daito, Yu Lei, Dien-Yeh Wu, Jallepally Ravi | 2023-08-08 |
| 11515200 | Selective tungsten deposition within trench structures | Yufei Hu, He Ren, Yu Lei, Shi YOU, Kazuya Daito | 2022-11-29 |
| 11421322 | Blocker plate for use in a substrate process chamber | Xiaoxiong Yuan, Yu Lei, Kazuya Daito, Pingyan Lei, Dien-Yeh Wu +2 more | 2022-08-23 |
| 11417568 | Methods for selective deposition of tungsten atop a dielectric layer for bottom up gapfill | Wei Lei, Yu Lei, Tae Hong Ha, Raymond Hung, Shirish A. PETHE | 2022-08-16 |
| 11404313 | Selective tungsten deposition at low temperatures | Yufei Hu, Yu Lei, Kazuya Daito, Da He, Jiajie Cen | 2022-08-02 |
| 11380536 | Multi-step pre-clean for selective metal gap fill | Xi Cen, Yakuan Yao, Yiming Lai, Kai Wu, Avgerinos V. Gelatos +8 more | 2022-07-05 |
| 11371117 | Process for multi-recycling, low-energy and high-purity extraction of lithium | — | 2022-06-28 |
| 11355391 | Method for forming a metal gapfill | Xi Cen, Feiyue Ma, Kai Wu, Yu Lei, Kazuya Daito +13 more | 2022-06-07 |
| 11171045 | Deposition of metal films with tungsten liner | Yu Lei, Sang-Hyeob Lee, Chris Pabelico, Tae Hong Ha, Xianmin Tang +1 more | 2021-11-09 |
| 11164780 | Process integration approach for selective metal via fill | Shi YOU, He Ren, Mehul Naik, Feng Chen | 2021-11-02 |
| 10665450 | Methods and apparatus for doping engineering and threshold voltage tuning by integrated deposition of titanium nitride and aluminum films | Yixiong Yang, Paul F. Ma, Wei V. Tang, Wenyu Zhang, Shih Chung Chen +6 more | 2020-05-26 |
| 10535527 | Methods for depositing semiconductor films | Takashi Kuratomi, Avgerinos V. Gelatos, Vikash Banthia, Mei Chang, Kazuya Daito | 2020-01-14 |