Issued Patents All Time
Showing 25 most recent of 99 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7452808 | Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding | Simon Chooi, Yakub Aliyu, Mei Sheng Zhou, John Sudijono, Sudipto Ranendra Roy +2 more | 2008-11-18 |
| RE39518 | Run to run control process for controlling critical dimensions | Anthony J. Toprac, Douglas John Downey | 2007-03-13 |
| 7060613 | Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding | Simon Chooi, Yakub Aliyu, Mei Sheng Zhou, John Sudijono, Sudipto Ranendra Roy +2 more | 2006-06-13 |
| 6967162 | Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding | Simon Chooi, Yakub Aliyu, Mei Sheng Zhou, John Sudijono, Sudipto Ranendra Roy +2 more | 2005-11-22 |
| 6821888 | Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding | Yakub Aliyu, Simon Chooi, Meisheng Zhou, John Sudijono, Sudipto Ranendra Roy | 2004-11-23 |
| 6813796 | Apparatus and methods to clean copper contamination on wafer edge | Sudipto Ranendra Roy, Simon Chooi, Xu Yi, Yakub Aliyu, Mei Sheng Zhou +2 more | 2004-11-09 |
| 6740580 | Method to form copper interconnects by adding an aluminum layer to the copper diffusion barrier | Chyi S. Chern, Mei Sheng Zhou | 2004-05-25 |
| 6720204 | Method of using hydrogen plasma to pre-clean copper surfaces during Cu/Cu or Cu/metal bonding | John Sudijono, Yakub Aliyu, Mei Sheng Zhou, Simon Chooi, Sudipto Ranendra Roy +2 more | 2004-04-13 |
| 6705512 | Method of application of conductive cap-layer in flip-chip, cob, and micro metal bonding | Kwok Keung Paul Ho, Simon Chooi, Yi Xu, Yakub Aliyu, Mei Sheng Zhou +2 more | 2004-03-16 |
| 6692579 | Method for cleaning semiconductor structures using hydrocarbon and solvents in a repetitive vapor phase/liquid phase sequence | Sudipto Ranendra Roy, Yi Xu, Simon Chooi, Yakub Aliyu, Mei Sheng Zhou +2 more | 2004-02-17 |
| 6683002 | Method to create a copper diffusion deterrent interface | Simon Chooi, Yakub Aliyu, Mei Sheng Zhou, John Sudijono, Sudipto Ranendra Roy +2 more | 2004-01-27 |
| 6656643 | Method of extreme ultraviolet mask engineering | Mei Sheng Zhou | 2003-12-02 |
| 6565664 | Method for stripping copper in damascene interconnects | Simon Chooi, Paul Ho, Mei Sheng Zhou | 2003-05-20 |
| 6566260 | Non-metallic barrier formations for copper damascene type interconnects | Simon Chooi, Mei Sheng Zhou, Sangki Hong | 2003-05-20 |
| 6540841 | Method and apparatus for removing contaminants from the perimeter of a semiconductor substrate | Sudipto Ranendra Roy, Simon Chooi, Xu Yi, Yakub Aliyu, Mei Sheng Zhou +2 more | 2003-04-01 |
| 6531390 | Non-metallic barrier formations for copper damascene type interconnects | Simon Chooi, Mei Sheng Zhou, Sangki Hong | 2003-03-11 |
| 6515342 | Method and system for providing inorganic vapor surface treatment for photoresist adhesion promotion | Bhanwar Singh, Carmen Morales | 2003-02-04 |
| 6489233 | Non-metallic barrier formations for copper damascene type interconnects | Simon Chooi, Mei Sheng Zhou, Sangki Hong | 2002-12-03 |
| 6475810 | Method of manufacturing embedded organic stop layer for dual damascene patterning | Mei Sheng Zhou, John Sudijono, Sudipto Ranendra Roy, Paul Ho, Yi Xu +2 more | 2002-11-05 |
| 6465888 | Composite silicon-metal nitride barrier to prevent formation of metal fluorides in copper damascene | Simon Chooi, Mei Sheng Zhou, Sang-Ki Hong | 2002-10-15 |
| 6465157 | Dual layer pattern formation method for dual damascene interconnect | Jianxun Li, Mei Sheng Zhou, Ming hui Far | 2002-10-15 |
| 6429122 | Non metallic barrier formations for copper damascene type interconnects | Simon Chooi, Mei Sheng Zhou, Sangki Hong | 2002-08-06 |
| 6429117 | Method to create copper traps by modifying treatment on the dielectrics surface | John Sudijono, Yakub Aliyu, Mei Sheng Zhou, Simon Chooi, Sudipto Ranendra Roy +2 more | 2002-08-06 |
| 6415973 | Method of application of copper solution in flip-chip, COB, and micrometal bonding | Kwok Keung Paul Ho, Simon Chooi, Yi Xu, Mei Sheng Zhou, Yakub Aliyu +2 more | 2002-07-09 |
| 6417088 | Method of application of displacement reaction to form a conductive cap layer for flip-chip, COB, and micro metal bonding | Kwok Keung Paul Ho, Yi Xu, Simon Chooi, Yakub Aliyu, Mei Sheng Zhou +2 more | 2002-07-09 |