Issued Patents All Time
Showing 51–75 of 99 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6251786 | Method to create a copper dual damascene structure with less dishing and erosion | Mei Sheng Zhou, Paul Ho | 2001-06-26 |
| 6232048 | Method for preparing narrow photoresist lines | Matthew S. Buynoski, Che-Hoo Ng, Bhanwar Singh, Shekhan Pramanick | 2001-05-15 |
| 6225221 | Method to deposit a copper seed layer for dual damascene interconnects | Paul Ho, Mei Sheng Zhou, Chockalingam Ramasamy | 2001-05-01 |
| 6225202 | Selective etching of unreacted nickel after salicidation | Mei Sheng Zhou, Simon Chooi, Sangki Hong | 2001-05-01 |
| 6184138 | Method to create a controllable and reproducible dual copper damascene structure | Paul Ho, Mei Sheng Zhou | 2001-02-06 |
| 6172421 | Semiconductor device having an intermetallic layer on metal interconnects | Paul R. Besser, Shekhar Pramanick, Takeshi Nogami | 2001-01-09 |
| 6132521 | Cleaning metal surfaces with alkyldione peroxides | Simon Chooi, Mei Sheng Zhou, Paul Ho | 2000-10-17 |
| 6114243 | Method to avoid copper contamination on the sidewall of a via or a dual damascene structure | Kwok Keung Paul Ho, Mei Sheng Zhou, Simon Yew-Meng Chool | 2000-09-05 |
| 6106286 | Method and device for administering medicine to the periodontium | — | 2000-08-22 |
| 6071824 | Method and system for patterning to enhance performance of a metal layer of a semiconductor device | Bhanwar Singh, Mutya Vicente, Susan H. Chen | 2000-06-06 |
| 6066578 | Method and system for providing inorganic vapor surface treatment for photoresist adhesion promotion | Bhanwar Singh, Carmen Morales | 2000-05-23 |
| 6051882 | Subtractive dual damascene semiconductor device | Steven C. Avanzino, Rich Klein, Scott Luning, Ming-Rin Lin | 2000-04-18 |
| 6040619 | Semiconductor device including antireflective etch stop layer | Fei Wang, David K. Foote, Myron R. Cagan | 2000-03-21 |
| 5994206 | Method of forming a high conductivity metal interconnect using metal gettering plug and system performing the method | Susan H. Chen | 1999-11-30 |
| 5936307 | Surface modification method for film stress reduction | Diana M. Schonauer, Paul R. Besser, Bhanwar Singh | 1999-08-10 |
| 5926690 | Run-to-run control process for controlling critical dimensions | Anthony J. Toprac, Douglas John Downey | 1999-07-20 |
| 5910453 | Deep UV anti-reflection coating etch | Mutya Vicente | 1999-06-08 |
| 5841196 | Fluted via formation for superior metal step coverage | Robert Flores, Michael Ross Stamm, Eric Thomas Sharp, Erich W. E. Denninger, Pamela G. Dye +2 more | 1998-11-24 |
| 5814560 | Metallization sidewall passivation technology for deep sub-half micrometer IC applications | Robin Cheung, Simon S. Chan | 1998-09-29 |
| 5795823 | Self aligned via dual damascene | Steven C. Avanzino, Rich Klein, Scott Luning, Ming-Ren Lin | 1998-08-18 |
| 5770519 | Copper reservoir for reducing electromigration effects associated with a conductive via in a semiconductor device | Richard K. Klein, Darrell M. Erb, Steven C. Avanzino, Robin Cheung, Scott Luning +2 more | 1998-06-23 |
| D394705 | Tongue cleaner | — | 1998-05-26 |
| 5746884 | Fluted via formation for superior metal step coverage | Robert Flores, Michael Ross Stamm, Eric Thomas Sharp, Erich W. E. Denninger, Pamela G. Dye +2 more | 1998-05-05 |
| 5717621 | Speedup for solution of systems of linear equations | Ravi Mehrotra | 1998-02-10 |
| 5705430 | Dual damascene with a sacrificial via fill | Steven C. Avanzino, Rich Klein, Scott Luning, Ming-Ren Lin | 1998-01-06 |