| 8860142 |
Method and apparatus to reduce thermal variations within an integrated circuit die using thermal proximity correction |
Debora Chyiu Hyia Poon, Alex See, Francis Benistant, Benjamin Colombeau, Yun Ling Tan +1 more |
2014-10-14 |
|
| 8754447 |
Strained channel transistor structure and method |
Jin Ping Liu, Alex See, Liang-Choo Hsia |
2014-06-17 |
|
| 8716076 |
Method for fabricating a semiconductor device having an epitaxial channel and transistor having same |
Jinping Liu, Alex See, Liang-Choo Hsia |
2014-05-06 |
|
| 8546873 |
Integrated circuit and method of fabrication thereof |
Jinping Liu, Hai Cong, Binbin Zhou, Alex See, Liang-Choo Hsia |
2013-10-01 |
|
| 8415236 |
Methods for reducing loading effects during film formation |
Han-Guan Chew, Jinping Liu, Alex See |
2013-04-09 |
|
| 8394724 |
Processing with reduced line end shortening ratio |
Hai Cong, Wei Loong Loh, Krishan Gopal, Xin Ji Zhang, Pradeep Ramachandramurthy Yelehanka |
2013-03-12 |
|
| 8354347 |
Method of forming high-k dielectric stop layer for contact hole opening |
Jianhui Ye, Huang Liu, Alex See, Wei Lu, Chun Hui Low +2 more |
2013-01-15 |
|
| 8324011 |
Implementation of temperature-dependent phase switch layer for improved temperature uniformity during annealing |
Chyiu Hyia Poon, Alex See |
2012-12-04 |
|
| 8293544 |
Method and apparatus to reduce thermal variations within an integrated circuit die using thermal proximity correction |
Debora Chyiu Hyia Poon, Alex See, Francis Benistant, Benjamin Colombeau, Yun Ling Tan +1 more |
2012-10-23 |
|
| 8058123 |
Integrated circuit and method of fabrication thereof |
Jinping Liu, Hai Cong, Binbin Zhou, Alex See, Liang-Choo Hsia |
2011-11-15 |
|
| 8012839 |
Method for fabricating a semiconductor device having an epitaxial channel and transistor having same |
Jinping Liu, Alex See, Liang-Choo Hsia |
2011-09-06 |
|
| 7966142 |
Multi-variable regression for metrology |
Wen-Zhan Zhou, Zheng Zou, Jasper Goh |
2011-06-21 |
|
| 7960283 |
Method for reducing silicide defects in integrated circuits |
Jeff Jianhui Ye, Huang Liu, Alex See, Wei Lu, Hai Cong +2 more |
2011-06-14 |
|
| 7902066 |
Damascene contact structure for integrated circuits |
Jian Ye |
2011-03-08 |
|
| 7879732 |
Thin film etching method and semiconductor device fabrication using same |
Xiang Hu, Hai Cong, Pradeep Ramachandramurthy Yelehanka |
2011-02-01 |
|
| 7776699 |
Strained channel transistor structure and method |
Jin Ping Liu, Alex See, Liang-Choo Hsia |
2010-08-17 |
|
| 7745320 |
Method for reducing silicide defects in integrated circuits |
Jeff Jianhui Ye, Huang Liu, Alex See, Wei Lu, Hai Cong +2 more |
2010-06-29 |
|
| 7452808 |
Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding |
Simon Chooi, Yakub Aliyu, John Sudijono, Subhash Gupta, Sudipto Ranendra Roy +2 more |
2008-11-18 |
$115,000 |
| 7354623 |
Surface modification of a porous organic material through the use of a supercritical fluid |
Ching-Ya Wang, Ping Chuang, Sunny Wu, Yu-Liang Lin, Hung-Jung Tu +1 more |
2008-04-08 |
$3,924,000 |
| 7338909 |
Micro-etching method to replicate alignment marks for semiconductor wafer photolithography |
Yu-Liang Lin, Henry Lo, Chung-Long Chang, Gorge Huang, Tony Lu +8 more |
2008-03-04 |
$12,742,000 |
| 7179879 |
Poly(arylene ether) dielectrics |
Christopher Lim, Siu Choon Ng, Hardy Chan, Simon Chooi |
2007-02-20 |
$829,000 |
| 7166250 |
Poly(arylene ether) dielectrics |
Christopher Lim, Siu Choon Ng, Hardy Chan, Simon Chooi |
2007-01-23 |
$349,000 |
| 7083495 |
Advanced process control approach for Cu interconnect wiring sheet resistance control |
Chun-Hsien Lin, Ai-Sen Liu, Sunny Wu, Yu-Liang Lin, Henry Lo |
2006-08-01 |
$10,570,000 |
| 7071281 |
Poly(arylene ether) dielectrics |
Christopher Lim, Siu Choon Ng, Hardy Chan, Simon Chooi |
2006-07-04 |
|
| 7060613 |
Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding |
Simon Chooi, Yakub Aliyu, John Sudijono, Subhash Gupta, Sudipto Ranendra Roy +2 more |
2006-06-13 |
$118,000 |
