HL

Henry Lo

TSMC: 26 patents #1,323 of 12,232Top 15%
SS Sap Se: 1 patents #2,890 of 6,322Top 50%
📍 Baoshan, PA: #1 of 2 inventorsTop 50%
Overall (All Time): #86,499 of 4,157,543Top 3%
38
Patents All Time

Issued Patents All Time

Showing 1–25 of 38 patents

Patent #TitleCo-InventorsDate
10810263 User interface for accessing hierarchical data Cheng Yu Yao, Nan Wang 2020-10-20
9588505 Near non-adaptive virtual metrology and chamber control Tzu-Yu Wang, Chen-Hua Yu, Chien Rhone Wang, Jung Cheng Ko, Chih-Wei Lai +1 more 2017-03-07
9177843 Preventing contamination in integrated circuit manufacturing lines Chien-Ming Sung, Simon Wang, Jia-Ren Chen, Chen-Hua Yu, Jean Wang +1 more 2015-11-03
9037279 Clustering for prediction models in process control and for optimal dispatching Francis Ko, Tzu-Yu Wang, Kewei Zuo, Jean Wang, Chih-Wei Lai 2015-05-19
8682466 Automatic virtual metrology for semiconductor wafer result prediction Francis Ko, Chih-Wei Lai, Kewei Zuo, Jean Wang, Ping-Hsu Chen +2 more 2014-03-25
8433434 Near non-adaptive virtual metrology and chamber control Amy Wang, Chen-Hua Yu, Jean Wang, Francis Ko, Chih-Wei Lai +1 more 2013-04-30
8409993 Method and system for controlling copper chemical mechanical polish uniformity Francis Ko, Chun-Hsien Lin, Jean Wang, Chih-Wei Lai, Ping-Hsu Chen 2013-04-02
7974728 System for extraction of key process parameters from fault detection classification to enable wafer prediction Chun-Hsien Lin, Francis Ko, Kewei Zuo, Jean Wang 2011-07-05
7951723 Integrated etch and supercritical CO2 process and chamber design Ching-Ya Wang, Weng-Jin Wu, Jean Wang 2011-05-31
7928549 Integrated circuit devices with multi-dimensional pad structures Hai-Ching Chen, Harold C. H. Hsiung 2011-04-19
7851234 System and method for enhanced control of copper trench sheet resistance uniformity Francis Ko, Jean Wang, Chi-Chun Hsieh, Amy Wang 2010-12-14
7767471 Auto routing for optimal uniformity control Jean Wang, Francis Ko, Chi-Chun Hsieh, Amy Wang, Chih-Wei Lai +1 more 2010-08-03
7634325 Prediction of uniformity of a wafer Jean Wang, Francis Ko, Ping-Hsu Chen, Chih-Wei Lai 2009-12-15
7544606 Method to implement stress free polishing Jean Wang, Chia-Ming Yang, Joshua Tseng 2009-06-09
7387973 Method for improving low-K dielectrics by supercritical fluid treatments Ching-Ya Wang, Joshua Tseng 2008-06-17
7364161 Card game 2008-04-29
7354623 Surface modification of a porous organic material through the use of a supercritical fluid Ching-Ya Wang, Ping Chuang, Sunny Wu, Yu-Liang Lin, Hung-Jung Tu +1 more 2008-04-08
7338909 Micro-etching method to replicate alignment marks for semiconductor wafer photolithography Yu-Liang Lin, Chung-Long Chang, Gorge Huang, Tony Lu, Gnesh Yeh +8 more 2008-03-04
7332449 Method for forming dual damascenes with supercritical fluid treatments Ching-Ya Wang, Joshua Tseng, Jean Wang 2008-02-19
7129151 Planarizing method employing hydrogenated silicon nitride planarizing stop layer Ping Chuang, Mei Shang Zhou 2006-10-31
7121550 Card game 2006-10-17
7083495 Advanced process control approach for Cu interconnect wiring sheet resistance control Chun-Hsien Lin, Ai-Sen Liu, Sunny Wu, Yu-Liang Lin, Mei Sheng Zhou 2006-08-01
7055822 Card game 2006-06-06
7004467 Card game 2006-02-28
6987064 Method and composition to improve a nitride/oxide wet etching selectivity Ping Chuang, Huxley Lee 2006-01-17