Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11225113 | Unique ID electronic tag for tire | Pi Sung Su, Hsin Cheng Pao, Yun-Da Jung | 2022-01-18 |
| RE47709 | Forming grounded through-silicon vias in a semiconductor substrate | Wei-Cheng Wu, Hsiao-Tsung Yen, Hsien-Pin Hu, Shang-Yun Hou, Shin-Puu Jeng | 2019-11-05 |
| 9691840 | Cylindrical embedded capacitors | An-Jhih Su, Tzu-Yu Wang, Wei-Cheng Wu, Hsien-Pin Hu, Shang-Yun Hou +2 more | 2017-06-27 |
| 9159673 | Forming interconnect structures using pre-ink-printed sheets | Jung Cheng Ko, Shang-Yun Hou, Wen-Chih Chiou, Shin-Puu Jeng, Chen-Hua Yu | 2015-10-13 |
| 8872345 | Forming grounded through-silicon vias in a semiconductor substrate | Wei-Cheng Wu, Hsiao-Tsung Yen, Hsien-Pin Hu, Shang-Yun Hou, Shin-Puu Jeng | 2014-10-28 |
| 8716867 | Forming interconnect structures using pre-ink-printed sheets | Francis Ko, Shang-Yun Hou, Wen-Chih Chiou, Shin-Puu Jeng, Chen-Hua Yu | 2014-05-06 |
| 8693163 | Cylindrical embedded capacitors | An-Jhih Su, Tzu-Yu Wang, Wei-Cheng Wu, Hsien-Pin Hu, Shang-Yun Hou +2 more | 2014-04-08 |
| 8294264 | Radiate under-bump metallization structure for semiconductor devices | Tzu-Yu Wang, An-Jhih Su, Hsien-Wei Chen, Shin-Puu Jeng, Liwei Lin | 2012-10-23 |
| 7851234 | System and method for enhanced control of copper trench sheet resistance uniformity | Francis Ko, Jean Wang, Henry Lo, Amy Wang | 2010-12-14 |
| 7767471 | Auto routing for optimal uniformity control | Jean Wang, Francis Ko, Henry Lo, Amy Wang, Chih-Wei Lai +1 more | 2010-08-03 |