Issued Patents All Time
Showing 1–25 of 52 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12320593 | Integrated vapor chamber | Tien-Lai Wang, Cheng-Yu Wang, Meng-Yu Lee | 2025-06-03 |
| 11682593 | Interposer test structures and methods | Tzuan-Horng Liu, Chen-Hua Yu, Hsien-Pin Hu, Wei-Cheng Wu, Shang-Yun Hou +1 more | 2023-06-20 |
| 11274957 | Method to calibrate disposable cartridge cuvette thickness in-situ | — | 2022-03-15 |
| 10734295 | Interposer test structures and methods | Tzuan-Horng Liu, Chen-Hua Yu, Hsien-Pin Hu, Wei-Cheng Wu, Shang-Yun Hou +1 more | 2020-08-04 |
| 10139263 | Method to calibrate disposable cartridge cuvette thickness in-situ | — | 2018-11-27 |
| 10090213 | Interposer test structures and methods | Tzuan-Horng Liu, Chen-Hua Yu, Hsien-Pin Hu, Wei-Cheng Wu, Shang-Yun Hou +1 more | 2018-10-02 |
| 10054938 | Clustering for prediction models in process control and for optimal dispatching | Jung Cheng Ko, Kewei Zuo, Kuan Teng Lo, Chien Rhone Wang, Chih-Wei Lai | 2018-08-21 |
| 10056347 | Bump structure for yield improvement | Tzu-Wei Chiu, Shang-Yun Hou, Shin-Puu Jeng, Hsien-Wei Chen, Hung-An Teng +1 more | 2018-08-21 |
| 9760670 | Semiconductor device design methods and conductive bump pattern enhancement methods | Wei-Cheng Wu, Kuo-Ching Hsu, Shang-Yun Hou, Shin-Puu Jeng | 2017-09-12 |
| 9691840 | Cylindrical embedded capacitors | An-Jhih Su, Chi-Chun Hsieh, Wei-Cheng Wu, Hsien-Pin Hu, Shang-Yun Hou +2 more | 2017-06-27 |
| 9589857 | Interposer test structures and methods | Tzuan-Horng Liu, Chen-Hua Yu, Hsien-Pin Hu, Wei-Cheng Wu, Shang-Yun Hou +1 more | 2017-03-07 |
| 9588505 | Near non-adaptive virtual metrology and chamber control | Chen-Hua Yu, Chien Rhone Wang, Henry Lo, Jung Cheng Ko, Chih-Wei Lai +1 more | 2017-03-07 |
| 9553053 | Bump structure for yield improvement | Tzu-Wei Chiu, Shang-Yun Hou, Shin-Puu Jeng, Hsien-Wei Chen, Hung-An Teng +1 more | 2017-01-24 |
| 9372951 | Semiconductor device design methods and conductive bump pattern enhancement methods | Wei-Cheng Wu, Kuo-Ching Hsu, Shang-Yun Hou, Shin-Puu Jeng | 2016-06-21 |
| 9337118 | Stress buffer structures in a mounting structure of a semiconductor device | Tzu-Wei Chiu, Shin-Puu Jeng | 2016-05-10 |
| 9128123 | Interposer test structures and methods | Tzuan-Horng Liu, Chen-Hua Yu, Hsien-Pin Hu, Wei-Cheng Wu, Shang-Yun Hou +1 more | 2015-09-08 |
| 9037279 | Clustering for prediction models in process control and for optimal dispatching | Francis Ko, Kewei Zuo, Henry Lo, Jean Wang, Chih-Wei Lai | 2015-05-19 |
| 8906798 | Methods of manufacturing stress buffer structures in a mounting structure of a semiconductor device | Tzu-Wei Chiu, Shin-Puu Jeng | 2014-12-09 |
| 8896089 | Interposers for semiconductor devices and methods of manufacture thereof | Tzu-Wei Chiu, Wei-Cheng Wu, Chun-Yi Liu, Hsien-Pin Hu, Shang-Yun Hou | 2014-11-25 |
| 8878182 | Probe pad design for 3DIC package yield analysis | Chen-Hua Yu, Shin-Puu Jeng, Shang-Yun Hou, Hsien-Pin Hu, Wei-Cheng Wu +2 more | 2014-11-04 |
| 8741234 | Disposable cartridge for fluid analysis | Ron L. Bardell, Lynn M. Seifried | 2014-06-03 |
| 8741233 | Disposable cartridge for fluid analysis | Ron L. Bardell, Mark Washa | 2014-06-03 |
| 8693163 | Cylindrical embedded capacitors | An-Jhih Su, Chi-Chun Hsieh, Wei-Cheng Wu, Hsien-Pin Hu, Shang-Yun Hou +2 more | 2014-04-08 |
| 8354750 | Stress buffer structures in a mounting structure of a semiconductor device | Tzu-Wei Chiu, Shin-Puu Jeng | 2013-01-15 |
| 8294264 | Radiate under-bump metallization structure for semiconductor devices | Chi-Chun Hsieh, An-Jhih Su, Hsien-Wei Chen, Shin-Puu Jeng, Liwei Lin | 2012-10-23 |