Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10290604 | Substrateless integrated circuit packages and methods of forming same | Lin-Chih Huang, Hsin-Yu Chen, Tsang-Jiuh Wu, Cheng-Chieh Hsieh | 2019-05-14 |
| 10056347 | Bump structure for yield improvement | Tzu-Wei Chiu, Tzu-Yu Wang, Shang-Yun Hou, Shin-Puu Jeng, Hsien-Wei Chen +1 more | 2018-08-21 |
| 9842825 | Substrateless integrated circuit packages and methods of forming same | Lin-Chih Huang, Hsin-Yu Chen, Tsang-Jiuh Wu, Cheng-Chieh Hsieh | 2017-12-12 |
| 9640490 | Through silicon via keep out zone formation method and system | Cheng-Chieh Hsieh, Shang-Yun Hou, Shin-Puu Jeng | 2017-05-02 |
| 9553053 | Bump structure for yield improvement | Tzu-Wei Chiu, Tzu-Yu Wang, Shang-Yun Hou, Shin-Puu Jeng, Hsien-Wei Chen +1 more | 2017-01-24 |
| 9054166 | Through silicon via keep out zone formation method and system | Cheng-Chieh Hsieh, Shang-Yun Hou, Shin-Puu Jeng | 2015-06-09 |
| 8836094 | Package device including an opening in a flexible substrate and methods of forming the same | Tsung-Shu Lin, Cheng-Chieh Hsieh, Sao-Ling Chiu, Shang-Yun Hou | 2014-09-16 |
| 8604619 | Through silicon via keep out zone formation along different crystal orientations | Cheng-Chieh Hsieh, Shang-Yun Hou, Shin-Puu Jeng | 2013-12-10 |