Issued Patents All Time
Showing 1–25 of 94 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412805 | Semiconductor package | Chen-Hsiang Lao, Yuan Sheng Chiu, Hung-Chi Li, Shih-Chang Ku | 2025-09-09 |
| 12394754 | Device and method for UBM/RDL routing | Meng-Tsan Lee, Wei-Cheng Wu | 2025-08-19 |
| 12387988 | Method of manufacturing semiconductor package having lid structure | Wensen Hung, Tsung-Yu Chen | 2025-08-12 |
| 12327819 | Devices employing thermal and mechanical enhanced layers and methods of forming same | Chen-Hua Yu, An-Jhih Su, Wei-Yu Chen, Ying-Ju Chen, Chin-Chuan Chang +5 more | 2025-06-10 |
| 12322727 | Device and method for UBM/RDL routing | Meng-Tsan Lee, Wei-Cheng Wu | 2025-06-03 |
| 12191224 | Semiconductor package and manufacturing method thereof | Wei-Chih Lai, Chien-Chia Chiu, Chen-Hua Yu, Der-Chyang Yeh, Cheng-Hsien Hsieh +3 more | 2025-01-07 |
| 12191239 | Stacked via structure disposed on a conductive pillar of a semiconductor die | Che-Yu Yeh, Wei-Cheng Wu, Tsung-Yu Chen, Li-Han Hsu, Chien-Fu Tseng | 2025-01-07 |
| 12170237 | Semiconductor structure and manufacturing method thereof | Wensen Hung, Ping-Kang Huang, Sao-Ling Chiu, Tsung-Yu Chen, Chien-Yuan Huang +1 more | 2024-12-17 |
| 12094836 | Semiconductor device having heat dissipation structure of curved profile and a manufacturing method thereof | Wensen Hung, Hsuan-Ning Shih, Hsien-Pin Hu, Tsung-Yu Chen, Wen-Hsin Wei | 2024-09-17 |
| 12080623 | Integrated circuit packages having mechanical brace standoffs | Yuan Sheng Chiu, Chih-Kai Cheng | 2024-09-03 |
| 12074154 | Package structure | Tsung-Yu Chen, Wensen Hung | 2024-08-27 |
| 12021006 | Package structure and method and equipment for forming the same | Wensen Hung, Tsung-Yu Chen, Chen-Hsiang Lao, Wen-Hsin Wei, Hsien-Pin Hu | 2024-06-25 |
| 11996342 | Semiconductor package comprising heat dissipation plates | Chen-Hsiang Lao, Yuan Sheng Chiu, Hung-Chi Li, Shih-Chang Ku | 2024-05-28 |
| 11955439 | Semiconductor package with redistribution structure and manufacturing method thereof | Wei-Cheng Wu, Chien-Chia Chiu, Cheng-Hsien Hsieh, Li-Han Hsu, Meng-Tsan Lee | 2024-04-09 |
| 11955401 | Package structure | Shih-Hui Wang, Der-Chyang Yeh, Shih-Peng Tai, Yi-Chung Huang | 2024-04-09 |
| 11929293 | Semiconductor package with lid structure | Wensen Hung, Tsung-Yu Chen | 2024-03-12 |
| 11923310 | Package structure including through via structures | Chih-Kai Cheng, Tsung-Yu Chen, Hsien-Pin Hu, Wen-Hsin Wei | 2024-03-05 |
| 11901320 | Contact pad for semiconductor device | Chang-Chia Huang, Cheng-Chieh Hsieh, Wei-Cheng Wu | 2024-02-13 |
| 11855030 | Package structure and method of manufacturing the same | Hsuan-Ning Shih | 2023-12-26 |
| 11855025 | Semiconductor device and package assembly including the same | Chita Chuang, Yao-Chun Chuang, Chen-Cheng Kuo, Chen-Shien Chen | 2023-12-26 |
| 11855018 | Semiconductor device and method of manufacture | Cheng-Hsien Hsieh, Hsien-Wei Chen, Chen-Hua Yu, Wei-Cheng Wu | 2023-12-26 |
| 11810833 | Package structure and method and equipment for forming the same | Wensen Hung, Tsung-Yu Chen, Chen-Hsiang Lao, Wen-Hsin Wei, Hsien-Pin Hu | 2023-11-07 |
| 11756870 | Stacked via structure disposed on a conductive pillar of a semiconductor die | Che-Yu Yeh, Wei-Cheng Wu, Tsung-Yu Chen, Li-Han Hsu, Chien-Fu Tseng | 2023-09-12 |
| 11715675 | Semiconductor device and manufacturing method thereof | Wensen Hung, Ping-Kang Huang, Sao-Ling Chiu, Tsung-Yu Chen, Chien-Yuan Huang +1 more | 2023-08-01 |
| 11676943 | Semiconductor structure and manufacturing method thereof | Chien-Yuan Huang, Shih-Chang Ku | 2023-06-13 |