Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11955401 | Package structure | Der-Chyang Yeh, Shih-Peng Tai, Tsung-Shu Lin, Yi-Chung Huang | 2024-04-09 |
| 11626341 | Package structure | Der-Chyang Yeh, Shih-Peng Tai, Tsung-Shu Lin, Yi-Chung Huang | 2023-04-11 |
| 11567000 | Method of infrared spectrometric measurement of tunnel gas | Cheng-Hsien Tsai, Fu-Yuan Hsiao, Shu-Yung Chi, Chih-Hao Yang | 2023-01-31 |
| 11289398 | Package structure and manufacturing method thereof | Der-Chyang Yeh, Shih-Peng Tai, Tsung-Shu Lin, Yi-Chung Huang | 2022-03-29 |
| 9922934 | Semiconductor manufacturing process and package carrier | Chih-Hung Cheng, Yung-Chi Lin, Wen-Chih Chiou | 2018-03-20 |
| 9806062 | Methods of packaging semiconductor devices and packaged semiconductor devices | Shin-Puu Jeng, Wen-Chih Chiou, Tu-Hao Yu, Hung-Jung Tu, Yu-Liang Lin | 2017-10-31 |
| 9478480 | Alignment mark and method of formation | Chen-Yu Tsai, Chien-Ming Chiu, Chia-Ho Chen, Fang Wen Tsai, Weng-Jin Wu +4 more | 2016-10-25 |
| 9406650 | Methods of packaging semiconductor devices and packaged semiconductor devices | Shin-Puu Jeng, Wen-Chih Chiou, Tu-Hao Yu, Hung-Jung Tu, Yu-Liang Lin | 2016-08-02 |
| 8896136 | Alignment mark and method of formation | Chen-Yu Tsai, Chien-Ming Chiu, Chia-Ho Chen, Fang Wen Tsai, Weng-Jin Wu +4 more | 2014-11-25 |