Issued Patents All Time
Showing 1–25 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11631734 | Vertical capacitor structure having capacitor in cavity, and method for manufacturing the vertical capacitor structure | Syu-Tang Liu, Huang-Hsien Chang, Tsung-Tang Tsai | 2023-04-18 |
| 11373956 | Semiconductor device package and method of manufacturing the same | Min-Lung Huang, Hsin Hsiang Wang, Chih-Wei Huang, Shiuan-Yu LIN | 2022-06-28 |
| 11264262 | Wafer debonding and cleaning apparatus | Wen-Chih Chiou, Yu-Liang Lin | 2022-03-01 |
| 11201110 | Semiconductor device package with conductive pillars and method for manufacturing the same | Min-Lung Huang, Hsin Hsiang Wang | 2021-12-14 |
| 11189604 | Device assembly structure and method of manufacturing the same | Chao-Kai Hung, Chien-Wei Chang, Ya-Chen Shih, Hung-Yi Lin, Cheng-Yuan KUNG | 2021-11-30 |
| 11127650 | Semiconductor device package including thermal dissipation element and method of manufacturing the same | Chien Lin CHANG CHIEN, Chiu-Wen LEE, Chang-Chi Lee, Chin-Li KAO | 2021-09-21 |
| 10847602 | Vertical capacitor structure having capacitor in cavity and method for manufacturing the same | Syu-Tang Liu, Huang-Hsien Chang, Tsung-Tang Tsai | 2020-11-24 |
| 10381254 | Wafer debonding and cleaning apparatus and method | Wen-Chih Chiou, Yu-Liang Lin | 2019-08-13 |
| 10068789 | Method of using a wafer cassette to charge an electrostatic carrier | Wen-Chih Chiou, Yung-Chi Lin, Yu-Liang Lin | 2018-09-04 |
| 9806062 | Methods of packaging semiconductor devices and packaged semiconductor devices | Shin-Puu Jeng, Wen-Chih Chiou, Tu-Hao Yu, Yu-Liang Lin, Shih-Hui Wang | 2017-10-31 |
| 9570331 | Wafer cassette with electrostatic carrier charging scheme | Wen-Chih Chiou, Yung-Chi Lin, Yu-Liang Lin | 2017-02-14 |
| 9406650 | Methods of packaging semiconductor devices and packaged semiconductor devices | Shin-Puu Jeng, Wen-Chih Chiou, Tu-Hao Yu, Yu-Liang Lin, Shih-Hui Wang | 2016-08-02 |
| 9390949 | Wafer debonding and cleaning apparatus and method of use | Wen-Chih Chiou, Yu-Liang Lin | 2016-07-12 |
| 9305769 | Thin wafer handling method | Chen-Hua Yu, Wen-Chih Chiou, Shin-Puu Jeng | 2016-04-05 |
| 9093489 | Selective curing method of adhesive on substrate | Tu-Hao Yu, Wen-Chih Chiou, Yu-Liang Lin | 2015-07-28 |
| 8759150 | Approach for bonding dies onto interposers | Hsien-Pin Hu, Chen-Hua Yu, Shin-Puu Jeng, Shang-Yun Hou, Jing-Cheng Lin +1 more | 2014-06-24 |
| 8749027 | Robust TSV structure | Hsien-Wei Chen, Shin-Puu Jeng, Wen-Chih Chiou | 2014-06-10 |
| 8664749 | Component stacking using pre-formed adhesive films | Weng-Jin Wu, Ku-Feng Yang, Jung-Chih Hu, Wen-Chih Chiou | 2014-03-04 |
| 8629066 | Liner formation in 3DIC structures | Ching-Yu Lo, Hai-Ching Chen, Tien-I Bao, Wen-Chih Chiou, Chen-Hua Yu | 2014-01-14 |
| 8405225 | Three-dimensional integrated circuits with protection layers | Chen-Hua Yu, Wen-Chih Chiou, Weng-Jin Wu, Ku-Feng Yang | 2013-03-26 |
| 8319349 | Approach for bonding dies onto interposers | Hsien-Pin Hu, Chen-Hua Yu, Shin-Puu Jeng, Shang-Yun Hou, Jing-Cheng Lin +1 more | 2012-11-27 |
| 8264066 | Liner formation in 3DIC structures | Ching-Yu Lo, Hai-Ching Chen, Tien-I Bao, Wen-Chih Chiou, Chen-Hua Yu | 2012-09-11 |
| 8148826 | Three-dimensional integrated circuits with protection layers | Chen-Hua Yu, Wen-Chih Chiou, Weng-Jin Wu, Ku-Feng Yang | 2012-04-03 |
| 8105875 | Approach for bonding dies onto interposers | Hsien-Pin Hu, Chen-Hua Yu, Shin-Puu Jeng, Shang-Yun Hou, Jing-Cheng Lin +1 more | 2012-01-31 |
| 8053277 | Three-dimensional integrated circuits with protection layers | Chen-Hua Yu, Wen-Chih Chiou, Weng-Jin Wu, Ku-Feng Yang | 2011-11-08 |