Issued Patents All Time
Showing 25 most recent of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12368104 | Electronic package | Hung-Yi Lin | 2025-07-22 |
| 12272766 | Semiconductor device package and method of manufacturing the same | Tang-Yuan Chen, Meng-Wei Hsieh | 2025-04-08 |
| 12218075 | Package structure | Hsu-Chiang Shih, Hung-Yi Lin, Chien-Mei Huang | 2025-02-04 |
| 12051658 | Semiconductor package structure and method for manufacturing the same | Hung-Yi Lin | 2024-07-30 |
| 11935841 | Semiconductor package structure and method for manufacturing the same | Hung-Yi Lin, Meng-Wei Hsieh, Yu-Pin Tsai | 2024-03-19 |
| 11923825 | Semiconductor device and method for manufacturing the same | Meng-Wei Hsieh | 2024-03-05 |
| 11798890 | Assembly structure and package structure | Hung-Yi Lin | 2023-10-24 |
| 11784111 | Semiconductor device and method for manufacturing the same | Hung-Yi Lin, Chin-Cheng Kuo, Wu Chou Hsu | 2023-10-10 |
| 11756896 | Semiconductor package structure including shielding layer contacting conductive contact | Meng-Wei Hsieh | 2023-09-12 |
| 11722220 | System comprising packaged optical devices | Chang-Yu Lin, Hung-Yi Lin | 2023-08-08 |
| 11594660 | Semiconductor device package | Tang-Yuan Chen, Meng-Wei Hsieh | 2023-02-28 |
| 11545427 | Capacitor bank structure and semiconductor package structure | Chien-Hua Chen, Teck-Chong Lee, Hung-Yi Lin, Pao-Nan Lee, Hsin Hsiang Wang +2 more | 2023-01-03 |
| 11508668 | Semiconductor package structure and method for manufacturing the same | Hung-Yi Lin, Meng-Wei Hsieh, Yu-Pin Tsai | 2022-11-22 |
| 11502067 | Package structure and method for manufacturing the same | Chien-Hua Chen | 2022-11-15 |
| 11348885 | Semiconductor package structure and method for manufacturing the same | Hung-Yi Lin | 2022-05-31 |
| 11296043 | Semiconductor device packages and methods of manufacturing the same | Hung-Yi Lin, Chang-Yu Lin | 2022-04-05 |
| 11233010 | Assembly structure and package structure | Hung-Yi Lin | 2022-01-25 |
| 11201125 | Semiconductor package and semiconductor process | Sheng-Chi Hsieh, Hung-Yi Lin, Pao-Nan Lee, Chien-Hua Chen | 2021-12-14 |
| 11189604 | Device assembly structure and method of manufacturing the same | Chao-Kai Hung, Chien-Wei Chang, Ya-Chen Shih, Hung-Jung Tu, Hung-Yi Lin | 2021-11-30 |
| 11037846 | Semiconductor package structure and method of manufacturing the same | Chien-Hua Chen, Hsu-Chiang Shih, Hung-Yi Lin | 2021-06-15 |
| 10903907 | System comprising packaged optical devices | Chang-Yu Lin, Hung-Yi Lin | 2021-01-26 |
| 10490341 | Electrical device | Hung-Yi Lin, Teck-Chong Lee, Sheng-Chi Hsieh, Chien-Hua Chen | 2019-11-26 |
| 10475718 | Semiconductor device package comprising a dielectric layer with built-in inductor | Chien-Hua Chen, Hung-Yi Lin, Teck-Chong Lee, Shiuan-Yu LIN | 2019-11-12 |
| 10475734 | Semiconductor device package | Chien-Hua Chen, Sheng-Chi Hsieh | 2019-11-12 |
| 10472228 | MEMS device package and method for manufacturing the same | Chien-Hua Chen, Che-Hau Huang, Chin-Cheng Kuo | 2019-11-12 |