Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12374631 | Semiconductor device package and method of manufacturing the same | Hung-Yi Lin, Meng-Wei Hsieh, Yu-Sheng Chang, Hsiu-Chi Liu, Mark A. Gerber | 2025-07-29 |
| 12218075 | Package structure | Cheng-Yuan KUNG, Hung-Yi Lin, Chien-Mei Huang | 2025-02-04 |
| 11342282 | Semiconductor device package including a reinforcement structure on an electronic component and method of manufacturing the same | Hung-Yi Lin, Meng-Wei Hsieh, Yu-Sheng Chang, Hsiu-Chi Liu, Mark A. Gerber | 2022-05-24 |
| 11037846 | Semiconductor package structure and method of manufacturing the same | Chien-Hua Chen, Cheng-Yuan KUNG, Hung-Yi Lin | 2021-06-15 |
| 10304765 | Semiconductor device package | Chien-Hua Chen, Ming-Hung Chen | 2019-05-28 |
| 9881917 | Semiconductor device and method of manufacturing the same | Sheng-Chi Hsieh, Chien-Hua Chen, Teck-Chong Lee | 2018-01-30 |
| 8853819 | Semiconductor structure with passive element network and manufacturing method thereof | Chien-Hua Chen, Teck-Chong Lee, Meng-Wei Hsieh | 2014-10-07 |