Issued Patents All Time
Showing 25 most recent of 43 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12374631 | Semiconductor device package and method of manufacturing the same | Hsu-Chiang Shih, Hung-Yi Lin, Meng-Wei Hsieh, Yu-Sheng Chang, Hsiu-Chi Liu | 2025-07-29 |
| 12206185 | Antenna device | — | 2025-01-21 |
| 11862587 | Semiconductor package structure and method of manufacturing the same | — | 2024-01-02 |
| 11342282 | Semiconductor device package including a reinforcement structure on an electronic component and method of manufacturing the same | Hsu-Chiang Shih, Hung-Yi Lin, Meng-Wei Hsieh, Yu-Sheng Chang, Hsiu-Chi Liu | 2022-05-24 |
| 11146234 | Electrical device and method for manufacturing the same | — | 2021-10-12 |
| 10510643 | Semiconductor package with lead frame and recessed solder terminals | — | 2019-12-17 |
| 10177099 | Semiconductor package structure, package on package structure and packaging method | Rich Rice, Bradford J. Factor | 2019-01-08 |
| 9978667 | Semiconductor package with lead frame and recessed solder terminals | — | 2018-05-22 |
| 9929072 | Packaged semiconductor devices | — | 2018-03-27 |
| 9257341 | Method and structure of packaging semiconductor devices | — | 2016-02-09 |
| 9253910 | Circuit assembly | — | 2016-02-02 |
| 9129955 | Semiconductor flip-chip system having oblong connectors and reduced trace pitches | Abram Castro | 2015-09-08 |
| 8574967 | Method for fabricating array-molded package-on-package | David N. Walter | 2013-11-05 |
| 8430969 | Method for exposing and cleaning insulating coats from metal contact surfaces | Kurt Peter Wachtler | 2013-04-30 |
| 8304285 | Array-molded package-on-package having redistribution lines | David N. Walter | 2012-11-06 |
| 8133761 | Packaged system of semiconductor chips having a semiconductor interposer | Kurt Peter Wachtler, Abram Castro | 2012-03-13 |
| 8041036 | Method and apparatus for preventing the interception of data being transmitted to a web site by a monitoring program | Kevin M. Krone, Bradley Dale Newcomb, Robert Shaffer, Chris Stromberger, Steven F. Taylor | 2011-10-18 |
| 7944034 | Array molded package-on-package having redistribution lines | David N. Walter | 2011-05-17 |
| 7790509 | Method for fine-pitch, low stress flip-chip interconnect | — | 2010-09-07 |
| 7776653 | Controlling flip-chip techniques for concurrent ball bonds in semiconductor devices | David N. Walter, Duy-Loan T. Le | 2010-08-17 |
| 7675152 | Package-on-package semiconductor assembly | Shawn Martin O'Conner | 2010-03-09 |
| 7655552 | Double density method for wirebond interconnect | — | 2010-02-02 |
| 7582963 | Vertically integrated system-in-a-package | Wyatt Huddleston | 2009-09-01 |
| 7573137 | Controlling flip-chip techniques for concurrent ball bonds in semiconductor devices | David N. Walter, Duy-Loan T. Le | 2009-08-11 |
| 7573139 | Packed system of semiconductor chips having a semiconductor interposer | Kurt Peter Wachtler, Abram Castro | 2009-08-11 |