Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8800650 | Expandable tubulars for use in geologic structures | Jeffery A. Spray, Steven Svedeman, Peter Mckeighan, Shane Siebanaler, Peter Dewhurst +5 more | 2014-08-12 |
| 8574967 | Method for fabricating array-molded package-on-package | Mark A. Gerber | 2013-11-05 |
| 8304285 | Array-molded package-on-package having redistribution lines | Mark A. Gerber | 2012-11-06 |
| 7944034 | Array molded package-on-package having redistribution lines | Mark A. Gerber | 2011-05-17 |
| 7776653 | Controlling flip-chip techniques for concurrent ball bonds in semiconductor devices | Duy-Loan T. Le, Mark A. Gerber | 2010-08-17 |
| 7573137 | Controlling flip-chip techniques for concurrent ball bonds in semiconductor devices | Duy-Loan T. Le, Mark A. Gerber | 2009-08-11 |
| 6717276 | Two-metal layer ball grid array and chip scale package having local interconnects used in wire-bonded and flip-chip semiconductor assembly | Masood Murtuza | 2004-04-06 |
| 6707124 | HID land grid array packaged device having electrical and optical interconnects | Kurt Peter Wachtler, Larry J. Mowatt | 2004-03-16 |
| 6400573 | Multi-chip integrated circuit module | Larry J. Mowatt | 2002-06-04 |
| 6274391 | HDI land grid array packaged device having electrical and optical interconnects | Kurt Peter Wachtler, Larry J. Mowatt | 2001-08-14 |
| 5432677 | Multi-chip integrated circuit module | Larry J. Mowatt | 1995-07-11 |
| 5306670 | Multi-chip integrated circuit module and method for fabrication thereof | Larry J. Mowatt | 1994-04-26 |