| 12176298 |
Floating die package |
Benjamin Stassen Cook, Steven Kummerl |
2024-12-24 |
$52,373,000 |
| 11538717 |
Electronic package for integrated circuits and related methods |
Anindya Poddar, Usman Mahmood Chaudhry |
2022-12-27 |
$29,539,000 |
| 11538767 |
Integrated circuit package with partitioning based on environmental sensitivity |
Barry Jon Male, Paul Merle Emerson |
2022-12-27 |
$29,539,000 |
| 11498831 |
Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip |
Makoto Yoshino, Ayumu Kuroda, Brian E. Goodlin, Karen Hildegard Ralston Kirmse, Benjamin Stassen Cook +2 more |
2022-11-15 |
$32,519,000 |
| 11387782 |
Stacked-die bulk acoustic wave oscillator package |
Ricky Alan Jackson |
2022-07-12 |
$31,136,000 |
| 10892712 |
Stacked-die bulk acoustic wave oscillator package |
Ricky Alan Jackson |
2021-01-12 |
$34,560,000 |
| 10861796 |
Floating die package |
Benjamin Stassen Cook, Steven Kummerl |
2020-12-08 |
$35,035,000 |
| 10861741 |
Electronic package for integrated circuits and related methods |
Anindya Poddar, Usman Mahmood Chaudhry |
2020-12-08 |
$35,035,000 |
| 10723616 |
Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip |
Makoto Yoshino, Ayumu Kuroda, Brian E. Goodlin, Karen Hildegard Ralston Kirmse, Benjamin Stassen Cook +2 more |
2020-07-28 |
$26,870,000 |
| 10574184 |
Stacked-die bulk acoustic wave oscillator package |
Ricky Alan Jackson |
2020-02-25 |
$17,811,000 |
| 10544039 |
Methods for depositing a measured amount of a species in a sealed cavity |
Benjamin Stassen Cook, Adam Joseph Fruehling, Juan Alejandro Herbsommer, Simon Joshua Jacobs |
2020-01-28 |
$17,667,000 |
| 10233074 |
Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip |
Makoto Yoshino, Ayumu Kuroda, Brian E. Goodlin, Karen Hildegard Ralston Kirmse, Benjamin Stassen Cook +2 more |
2019-03-19 |
$55,906,000 |
| 9896330 |
Structure and method for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip |
Makoto Yoshino, Ayumu Kuroda, Brian E. Goodlin, Karen Hildegard Ralston Kirmse, Benjamin Stassen Cook +2 more |
2018-02-20 |
$23,006,000 |
| 9312253 |
Heterogeneous integration of memory and split-architecture processor |
Kevin Lyne |
2016-04-12 |
$17,054,000 |
| 8957525 |
3D semiconductor interposer for heterogeneous integration of standard memory and split-architecture processor |
Kevin Lyne |
2015-02-17 |
$24,581,000 |
| 8823168 |
Die underfill structure and method |
— |
2014-09-02 |
$9,131,000 |
| 8597978 |
Method for attaching wide bus memory and serial memory to a processor within a chip scale package footprint |
Margaret Simmons-Matthews |
2013-12-03 |
$14,257,000 |
| 8430969 |
Method for exposing and cleaning insulating coats from metal contact surfaces |
Mark A. Gerber |
2013-04-30 |
$11,651,000 |
| 8338229 |
Stackable plasma cleaned via package and method |
Ludovico E. Bancod, Jin Seong Kim |
2012-12-25 |
|
| 8309388 |
MEMS package having formed metal lid |
Wei-Yan Shih, Gregory E. Howard |
2012-11-13 |
$8,774,000 |
| 8288849 |
Method for attaching wide bus memory and serial memory to a processor within a chip scale package footprint |
Margaret Simmons-Matthews |
2012-10-16 |
$6,135,000 |
| 8133761 |
Packaged system of semiconductor chips having a semiconductor interposer |
Mark A. Gerber, Abram Castro |
2012-03-13 |
$8,777,000 |
| 8030137 |
Flexible interposer for stacking semiconductor chips and connecting same to substrate |
— |
2011-10-04 |
$7,626,000 |
| 7928550 |
Flexible interposer for stacking semiconductor chips and connecting same to substrate |
— |
2011-04-19 |
$5,406,000 |
| 7872841 |
In package ESD protections of IC using a thin film polymer |
Yves Leduc, Nathalie Messina, Charvaka Duvvury |
2011-01-18 |
$19,351,000 |