Issued Patents All Time
Showing 1–25 of 38 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176298 | Floating die package | Benjamin Stassen Cook, Steven Kummerl | 2024-12-24 |
| 11538717 | Electronic package for integrated circuits and related methods | Anindya Poddar, Usman Mahmood Chaudhry | 2022-12-27 |
| 11538767 | Integrated circuit package with partitioning based on environmental sensitivity | Barry Jon Male, Paul Merle Emerson | 2022-12-27 |
| 11498831 | Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip | Makoto Yoshino, Ayumu Kuroda, Brian E. Goodlin, Karen Hildegard Ralston Kirmse, Benjamin Stassen Cook +2 more | 2022-11-15 |
| 11387782 | Stacked-die bulk acoustic wave oscillator package | Ricky Alan Jackson | 2022-07-12 |
| 10892712 | Stacked-die bulk acoustic wave oscillator package | Ricky Alan Jackson | 2021-01-12 |
| 10861796 | Floating die package | Benjamin Stassen Cook, Steven Kummerl | 2020-12-08 |
| 10861741 | Electronic package for integrated circuits and related methods | Anindya Poddar, Usman Mahmood Chaudhry | 2020-12-08 |
| 10723616 | Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip | Makoto Yoshino, Ayumu Kuroda, Brian E. Goodlin, Karen Hildegard Ralston Kirmse, Benjamin Stassen Cook +2 more | 2020-07-28 |
| 10574184 | Stacked-die bulk acoustic wave oscillator package | Ricky Alan Jackson | 2020-02-25 |
| 10544039 | Methods for depositing a measured amount of a species in a sealed cavity | Benjamin Stassen Cook, Adam Joseph Fruehling, Juan Alejandro Herbsommer, Simon Joshua Jacobs | 2020-01-28 |
| 10233074 | Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip | Makoto Yoshino, Ayumu Kuroda, Brian E. Goodlin, Karen Hildegard Ralston Kirmse, Benjamin Stassen Cook +2 more | 2019-03-19 |
| 9896330 | Structure and method for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip | Makoto Yoshino, Ayumu Kuroda, Brian E. Goodlin, Karen Hildegard Ralston Kirmse, Benjamin Stassen Cook +2 more | 2018-02-20 |
| 9312253 | Heterogeneous integration of memory and split-architecture processor | Kevin Lyne | 2016-04-12 |
| 8957525 | 3D semiconductor interposer for heterogeneous integration of standard memory and split-architecture processor | Kevin Lyne | 2015-02-17 |
| 8823168 | Die underfill structure and method | — | 2014-09-02 |
| 8597978 | Method for attaching wide bus memory and serial memory to a processor within a chip scale package footprint | Margaret Simmons-Matthews | 2013-12-03 |
| 8430969 | Method for exposing and cleaning insulating coats from metal contact surfaces | Mark A. Gerber | 2013-04-30 |
| 8338229 | Stackable plasma cleaned via package and method | Ludovico E. Bancod, Jin Seong Kim | 2012-12-25 |
| 8309388 | MEMS package having formed metal lid | Wei-Yan Shih, Gregory E. Howard | 2012-11-13 |
| 8288849 | Method for attaching wide bus memory and serial memory to a processor within a chip scale package footprint | Margaret Simmons-Matthews | 2012-10-16 |
| 8133761 | Packaged system of semiconductor chips having a semiconductor interposer | Mark A. Gerber, Abram Castro | 2012-03-13 |
| 8030137 | Flexible interposer for stacking semiconductor chips and connecting same to substrate | — | 2011-10-04 |
| 7928550 | Flexible interposer for stacking semiconductor chips and connecting same to substrate | — | 2011-04-19 |
| 7872841 | In package ESD protections of IC using a thin film polymer | Yves Leduc, Nathalie Messina, Charvaka Duvvury | 2011-01-18 |