Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12374608 | Hybrid chip carrier package | Yiqi Tang, Li Jiang, Rajen Manicon Murugan, Robert Falcone | 2025-07-29 |
| 12087673 | QFN device having a mechanism that enables an inspectable solder joint when attached to a PWB and method of making same | Abram Castro, Joe Adam Garcia, Mahmud Halim Chowdhury | 2024-09-10 |
| 11557722 | Hall-effect sensor package with added current path | Ming Li, Yiqi Tang, Jie Chen, Enis Tuncer, Tony R. Larson +3 more | 2023-01-17 |
| 11538717 | Electronic package for integrated circuits and related methods | Kurt Peter Wachtler, Anindya Poddar | 2022-12-27 |
| 11495524 | QFN device having a mechanism that enables an inspectable solder joint when attached to a PWB and method of making same | Abram Castro, Joe Adam Garcia, Mahmud Halim Chowdhury | 2022-11-08 |
| 10892405 | Hall-effect sensor package with added current path | Ming Li, Yiqi Tang, Jie Chen, Enis Tuncer, Tony R. Larson +3 more | 2021-01-12 |
| 10861741 | Electronic package for integrated circuits and related methods | Kurt Peter Wachtler, Anindya Poddar | 2020-12-08 |
| 8471155 | Metal plugged substrates with no adhesive between metal and polyimide | Donald C. Abbott | 2013-06-25 |
| 7918018 | Method of fabricating a semiconductor device | Donald C. Abbott | 2011-04-05 |