Issued Patents All Time
Showing 1–25 of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12418097 | Microelectronic device package including antenna and semiconductor device | Yiqi Tang, Juan Alejandro Herbsommer | 2025-09-16 |
| 12406915 | Plated metal layer in power packages | Jonathan Almeria Noquil, Makarand Ramkrishna Kulkarni, Osvaldo Jorge Lopez, Yiqi Tang, Liang Wan | 2025-09-02 |
| 12400945 | Electronic device multilevel package substrate for improved electromigration performance | Sylvester Ankamah-Kusi, Yiqi Tang, Sreenivasan K. Koduri | 2025-08-26 |
| 12394742 | Interconnect structure for high power GaN module including a printed planar interconnect line and method for making the same | Jie Chen, Yong Xie, Woochan Kim | 2025-08-19 |
| 12381139 | Electronic device and multilevel package substrate with elevated trace features for solder and/or die confinement and method for fabricating the electronic device | Yiqi Tang, Guangxu Li | 2025-08-05 |
| 12374608 | Hybrid chip carrier package | Yiqi Tang, Li Jiang, Robert Falcone, Usman Mahmood Chaudhry | 2025-07-29 |
| 12327736 | Multilayer package substrate with improved current density distribution | Yiqi Tang, Phuong Minh Vu, Sylvester Ankamah-Kusi | 2025-06-10 |
| 12322856 | Antenna in package having antenna on package substrate | Yiqi Tang, Makarand Ramkrishna Kulkarni, Liang Wan | 2025-06-03 |
| 12315987 | Antenna-on-package system | Yiqi Tang | 2025-05-27 |
| 12266596 | Semiconductor device with a power converter module connected to connection assembly | Yiqi Tang | 2025-04-01 |
| 12243911 | Integrated circuit package for isolation dies | Matthew David Romig, Enis Tuncer, Yiqi Tang | 2025-03-04 |
| 12243849 | Passives to facilitate mold compound flow | Chittranjan Mohan Gupta, Yiqi Tang, Jie Chen, Tianyi Luo | 2025-03-04 |
| 12224480 | Microelectronic device package including antenna horn and semiconductor device | Yiqi Tang | 2025-02-11 |
| 12218036 | Package substrate having integrated passive device(s) between leads | Yiqi Tang | 2025-02-04 |
| 12211800 | Semiconductor package with shunt and patterned metal trace | Yiqi Tang, Liang Wan, Makarand Ramkrishna Kulkarni, Jie Chen, Steven Kummerl | 2025-01-28 |
| 12191259 | Multi-channel gate driver package with grounded shield metal | Yiqi Tang, Jie Chen | 2025-01-07 |
| 12165989 | Semiconductor package with electromagnetic interference shielding | Jie Chen, Yiqi Tang, Liang Wan | 2024-12-10 |
| 12148556 | Integrated magnetic assembly | Yiqi Tang, Jonathan Almeria Noquil | 2024-11-19 |
| 12113293 | Antenna-on-package including multiple types of antenna | Yiqi Tang | 2024-10-08 |
| 12040265 | High-frequency ceramic packages with modified castellation and metal layer architectures | Yiqi Tang, Li Jiang | 2024-07-16 |
| 11978699 | Electronic device multilevel package substrate for improved electromigration preformance | Sylvester Ankamah-Kusi, Yiqi Tang, Sreenivasan K. Koduri | 2024-05-07 |
| 11978709 | Integrated system-in-package with radiation shielding | Vivek Swaminathan Sridharan, Yiqi Tang, Christopher Daniel Manack, Liang Wan, Hiep Xuan Nguyen | 2024-05-07 |
| 11955479 | Packaged semiconductor device | Yiqi Tang, Makarand Ramkrishna Kulkarni | 2024-04-09 |
| 11901271 | High current packages with reduced solder layer count | Yiqi Tang, Liang Wan, William Todd Harrison, Manu J. Prakuzhy | 2024-02-13 |
| 11881460 | Ceramic semiconductor package seal rings | Yiqi Tang, Li Jiang | 2024-01-23 |