Issued Patents All Time
Showing 25 most recent of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12243911 | Integrated circuit package for isolation dies | Enis Tuncer, Rajen Manicon Murugan, Yiqi Tang | 2025-03-04 |
| 12142550 | Multi-chip module leadless package | Wei Zhang, Mohammad Waseem Hussain, Peter Anthony Fundaro | 2024-11-12 |
| 11669069 | Methods, apparatus, and systems to facilitate multi-channel isolation | Mayank Garg | 2023-06-06 |
| 11538741 | Multi-chip module leadless package | Wei Zhang, Mohammad Waseem Hussain, Peter Anthony Fundaro | 2022-12-27 |
| 11525739 | Thermistor die-based thermal probe | Steven Aldred Kummerl, Steve Edward Harrell | 2022-12-13 |
| 11082028 | 3D-printed protective shell structures with support columns for stress sensitive circuits | James Cooper Wainerdi, Luu Thanh Nguyen, Alexander Harvey Scheuermann | 2021-08-03 |
| 11061384 | Methods, apparatus, and systems to facilitate multi-channel isolation | Mayank Garg | 2021-07-13 |
| 11049836 | Bond wire support systems and methods | Benjamin Stassen Cook | 2021-06-29 |
| 10756013 | Packaged semiconductor system having unidirectional connections to discrete components | Saumya Gandhi, Abram Castro | 2020-08-25 |
| 10566276 | Packaged semiconductor system having unidirectional connections to discrete components | Saumya Gandhi, Abram Castro | 2020-02-18 |
| 10516381 | 3D-printed protective shell structures for stress sensitive circuits | James Cooper Wainerdi, Luu Thanh Nguyen, Alexander Harvey Scheuermann | 2019-12-24 |
| 9899339 | Discrete device mounted on substrate | Lance Cole Wright, Leslie Edward Stark, Frank Stepniak, Sreenivasan K. Koduri | 2018-02-20 |
| 9852979 | Conductive through-polymer vias for capacitative structures integrated with packaged semiconductor chips | Frank Stepniak, Saumya Gandhi | 2017-12-26 |
| 9842797 | Stacked die power converter | Brian Ashley Carpenter, Christopher J. Sanzo, William Todd Harrison, Alok Kumar Lohia | 2017-12-12 |
| 9780017 | Packaged device with additive substrate surface modification | Benjamin Stassen Cook, Juan Alejandro Herbsommer, Yong Lin, Rongwei Zhang, Abram Castro | 2017-10-03 |
| 9768130 | Integrated power package | Christopher Daniel Manack | 2017-09-19 |
| 9679864 | Printed interconnects for semiconductor packages | Benjamin Stassen Cook, Juan Alejandro Herbsommer, Steven Kummerl, Wei-Yan Shih | 2017-06-13 |
| 9647329 | Encapsulated molded package with embedded antenna for high data rate communication using a dielectric waveguide | Juan Alejandro Herbsommer | 2017-05-09 |
| 9572261 | Conductive through-polymer vias for capacitative structures integrated with packaged semiconductor chips | Frank Stepniak, Saumya Gandhi | 2017-02-14 |
| 9527728 | Integrated circuit package and method | Marie-Solange Anne Milleron, Benjamin Michael Sutton | 2016-12-27 |
| 9524926 | Packaged device with additive substrate surface modification | Benjamin Stassen Cook, Juan Alejandro Herbsommer, Yong Lin, Rongwei Zhang, Abram Castro | 2016-12-20 |
| 9496171 | Printed interconnects for semiconductor packages | Benjamin Stassen Cook, Juan Alejandro Herbsommer, Steven Kummerl, Wei-Yan Shih | 2016-11-15 |
| 9111845 | Integrated circuit package with printed circuit layer | Lance Cole Wright, Leslie Edward Stark, Frank Stepniak, Sreenivasan K. Koduri | 2015-08-18 |
| 8945986 | Electronic assembly with three dimensional inkjet printed traces | Lance Cole Wright, Leslie Edward Stark, Frank Stepniak, Sreenivasan K. Koduri | 2015-02-03 |
| 8847349 | Integrated circuit package with printed circuit layer | Lance Cole Wright, Leslie Edward Stark, Frank Stepniak, Screenivasan K. Koduri | 2014-09-30 |