Issued Patents All Time
Showing 26–32 of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8816513 | Electronic assembly with three dimensional inkjet printed traces | Lance Cole Wright, Leslie Edward Stark, Frank Stepniak, Sreenivasan K. Koduri | 2014-08-26 |
| 8723337 | Structure for high-speed signal integrity in semiconductor package with single-metal-layer substrate | Gregory E. Howard, Marie-Solange Anne Milleron, Souvik Mukherjee | 2014-05-13 |
| 8716068 | Method for contacting agglomerate terminals of semiconductor packages | Darvin R. Edwards, Siva Prakash Gurrum, Masood Murtuza, Kazunori Hayata | 2014-05-06 |
| 8643165 | Semiconductor device having agglomerate terminals | Darvin R. Edwards, Siva Prakash Gurrum, Masood Murtuza, Kazunori Hayata | 2014-02-04 |
| 8299588 | Structure and method for uniform current distribution in power supply module | Tetsuo Tateishi | 2012-10-30 |
| 8298870 | Method for connecting integrated circuit chip to power and ground circuits | — | 2012-10-30 |
| 7863738 | Apparatus for connecting integrated circuit chip to power and ground circuits | — | 2011-01-04 |