Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12133049 | Reduced light reflection package | Roberto Brioschi, Jr-Cheng Yeh, Dinesh Kumar Solanki | 2024-10-29 |
| 11800297 | Reduced light reflection package | Roberto Brioschi, Jr-Cheng Yeh, Dinesh Kumar Solanki | 2023-10-24 |
| 11760627 | MEMS stress reduction structure embedded into package | Roberto Brioschi, Benyamin Gholami Bazehhour, Milena Vujosevic | 2023-09-19 |
| 11012790 | Flipchip package | Jeremy Parker | 2021-05-18 |
| 9536753 | Circuit substrate interconnect | Yohei Koto, Dan Okamoto | 2017-01-03 |
| 8815648 | Multi-step sintering of metal paste for semiconductor device wire bonding | Kengo Aoya, Shohta Ujiie | 2014-08-26 |
| 8716068 | Method for contacting agglomerate terminals of semiconductor packages | Darvin R. Edwards, Siva Prakash Gurrum, Masood Murtuza, Matthew David Romig | 2014-05-06 |
| 8643165 | Semiconductor device having agglomerate terminals | Darvin R. Edwards, Siva Prakash Gurrum, Masood Murtuza, Matthew David Romig | 2014-02-04 |