Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8815648 | Multi-step sintering of metal paste for semiconductor device wire bonding | Kengo Aoya, Kazunori Hayata | 2014-08-26 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8815648 | Multi-step sintering of metal paste for semiconductor device wire bonding | Kengo Aoya, Kazunori Hayata | 2014-08-26 |