Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12272626 | Conductive members atop semiconductor packages | Makoto Shibuya, Masamitsu Matsuura, Anindya Poddar | 2025-04-08 |
| 12154861 | Frame design in embedded die package | Woochan Kim, Masamitsu Matasuura, Mutsumi Masumoto, Hau Nguyen, Vivek Kishorechand Arora +2 more | 2024-11-26 |
| 12125799 | Embedded die packaging with integrated ceramic substrate | Woochan Kim, Mutsumi Masumoto, Vivek Kishorechand Arora, Anindya Poddar | 2024-10-22 |
| 12046542 | Heat-dissipating wirebonded members on package surfaces | Makoto Shibuya, Makoto Yoshino | 2024-07-23 |
| 12040260 | Electronic package with surface contact wire extensions | Makoto Shibuya, Ayumu Kuroda | 2024-07-16 |
| 11942384 | Semiconductor package having an interdigitated mold arrangement | Makoto Shibuya, Masamitsu Matsuura, Hideaki Matsunaga, Anindya Poddar | 2024-03-26 |
| 11923320 | Semiconductor device having tapered metal coated sidewalls | Tomoko Noguchi, Mutsumi Masumoto, Masamitsu Matsuura | 2024-03-05 |
| 11848244 | Leaded wafer chip scale packages | Makoto Shibuya, Masamitsu Matsuura | 2023-12-19 |
| 11601065 | Power converter module | Woochan Kim, Vivek Kishorechand Arora, Makoto Shibuya | 2023-03-07 |
| 11410875 | Fan-out electronic device | Hau Nguyen, Woochan Kim, Yi Yan, Luu Thanh Nguyen, Ashok S. Prabhu +3 more | 2022-08-09 |
| 11387179 | IC package with half-bridge power module | Makoto Shibuya, Woochan Kim, Vivek Kishorechand Arora | 2022-07-12 |
| 11183441 | Stress buffer layer in embedded package | Woochan Kim, Masamitsu Matsuura, Mutsumi Masumoto, Hau Nguyen, Vivek Kishorechand Arora +1 more | 2021-11-23 |
| 11183460 | Embedded die packaging with integrated ceramic substrate | Woochan Kim, Mutsumi Masumoto, Vivek Kishorechand Arora, Anindya Poddar | 2021-11-23 |
| 11158595 | Embedded die package multichip module | Woochan Kim, Masamitsu Matsuura, Mutsumi Masumoto, Hau Nguyen, Vivek Kishorechand Arora +1 more | 2021-10-26 |
| 10879144 | Semiconductor package with multilayer mold | Masamitsu Matsuura, Takeshi Onogami, Hideaki Matsunaga | 2020-12-29 |
| 10580715 | Stress buffer layer in embedded package | Woochan Kim, Masamitsu Matsuura, Mutsumi Masumoto, Hau Nguyen, Vivek Kishorechand Arora +1 more | 2020-03-03 |
| 8815648 | Multi-step sintering of metal paste for semiconductor device wire bonding | Shohta Ujiie, Kazunori Hayata | 2014-08-26 |
| 8434664 | Micro-ball loading device and loading method | — | 2013-05-07 |
| 8294261 | Protruding TSV tips for enhanced heat dissipation for IC devices | Kazuaki MAWATARI, Yoshikatsu Umeda, Jeffrey Alan West | 2012-10-23 |
| 7882625 | Transfer mask in micro ball mounter | — | 2011-02-08 |