| 12272626 |
Conductive members atop semiconductor packages |
Makoto Shibuya, Masamitsu Matsuura, Anindya Poddar |
2025-04-08 |
| 12154861 |
Frame design in embedded die package |
Woochan Kim, Masamitsu Matasuura, Mutsumi Masumoto, Hau Nguyen, Vivek Kishorechand Arora +2 more |
2024-11-26 |
| 12125799 |
Embedded die packaging with integrated ceramic substrate |
Woochan Kim, Mutsumi Masumoto, Vivek Kishorechand Arora, Anindya Poddar |
2024-10-22 |
| 12046542 |
Heat-dissipating wirebonded members on package surfaces |
Makoto Shibuya, Makoto Yoshino |
2024-07-23 |
| 12040260 |
Electronic package with surface contact wire extensions |
Makoto Shibuya, Ayumu Kuroda |
2024-07-16 |
| 11942384 |
Semiconductor package having an interdigitated mold arrangement |
Makoto Shibuya, Masamitsu Matsuura, Hideaki Matsunaga, Anindya Poddar |
2024-03-26 |
| 11923320 |
Semiconductor device having tapered metal coated sidewalls |
Tomoko Noguchi, Mutsumi Masumoto, Masamitsu Matsuura |
2024-03-05 |
| 11848244 |
Leaded wafer chip scale packages |
Makoto Shibuya, Masamitsu Matsuura |
2023-12-19 |
| 11601065 |
Power converter module |
Woochan Kim, Vivek Kishorechand Arora, Makoto Shibuya |
2023-03-07 |
| 11410875 |
Fan-out electronic device |
Hau Nguyen, Woochan Kim, Yi Yan, Luu Thanh Nguyen, Ashok S. Prabhu +3 more |
2022-08-09 |
| 11387179 |
IC package with half-bridge power module |
Makoto Shibuya, Woochan Kim, Vivek Kishorechand Arora |
2022-07-12 |
| 11183441 |
Stress buffer layer in embedded package |
Woochan Kim, Masamitsu Matsuura, Mutsumi Masumoto, Hau Nguyen, Vivek Kishorechand Arora +1 more |
2021-11-23 |
| 11183460 |
Embedded die packaging with integrated ceramic substrate |
Woochan Kim, Mutsumi Masumoto, Vivek Kishorechand Arora, Anindya Poddar |
2021-11-23 |
| 11158595 |
Embedded die package multichip module |
Woochan Kim, Masamitsu Matsuura, Mutsumi Masumoto, Hau Nguyen, Vivek Kishorechand Arora +1 more |
2021-10-26 |
| 10879144 |
Semiconductor package with multilayer mold |
Masamitsu Matsuura, Takeshi Onogami, Hideaki Matsunaga |
2020-12-29 |
| 10580715 |
Stress buffer layer in embedded package |
Woochan Kim, Masamitsu Matsuura, Mutsumi Masumoto, Hau Nguyen, Vivek Kishorechand Arora +1 more |
2020-03-03 |
| 8815648 |
Multi-step sintering of metal paste for semiconductor device wire bonding |
Shohta Ujiie, Kazunori Hayata |
2014-08-26 |
| 8434664 |
Micro-ball loading device and loading method |
— |
2013-05-07 |
| 8294261 |
Protruding TSV tips for enhanced heat dissipation for IC devices |
Kazuaki MAWATARI, Yoshikatsu Umeda, Jeffrey Alan West |
2012-10-23 |
| 7882625 |
Transfer mask in micro ball mounter |
— |
2011-02-08 |