Issued Patents All Time
Showing 1–25 of 60 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12272626 | Conductive members atop semiconductor packages | Masamitsu Matsuura, Kengo Aoya, Anindya Poddar | 2025-04-08 |
| 12230539 | Wafer chip scale packaging with ball attach before repassivation | Daiki Komatsu | 2025-02-18 |
| 12119263 | Methods and apparatus for an improved integrated circuit package | — | 2024-10-15 |
| 12046542 | Heat-dissipating wirebonded members on package surfaces | Makoto Yoshino, Kengo Aoya | 2024-07-23 |
| 12040260 | Electronic package with surface contact wire extensions | Ayumu Kuroda, Kengo Aoya | 2024-07-16 |
| 11955456 | Flip chip packaged devices with thermal pad | Anindya Poddar, Ashok S. Prabhu, Hau Nguyen, Kurt Sincerbox | 2024-04-09 |
| 11942384 | Semiconductor package having an interdigitated mold arrangement | Masamitsu Matsuura, Kengo Aoya, Hideaki Matsunaga, Anindya Poddar | 2024-03-26 |
| 11933533 | Blower and refrigerator | Tomohiko Matsuno, Tomoharu Iwamoto, Tatsuya Seo, Hitoshi Takase | 2024-03-19 |
| 11848244 | Leaded wafer chip scale packages | Masamitsu Matsuura, Kengo Aoya | 2023-12-19 |
| 11842952 | Double side heat dissipation for silicon chip package | — | 2023-12-12 |
| 11764142 | Semiconductor apparatus and method having a lead frame with floating leads | — | 2023-09-19 |
| 11725864 | Refrigerator | Kentaro Kan, Hiroshi Nakamura, Manabu Kikuchi, Ryota Aoki, Tomohiko Matsuno | 2023-08-15 |
| 11656021 | Refrigerator | Kentaro Kan, Manabu Kikuchi, Tomohiko Matsuno | 2023-05-23 |
| 11601065 | Power converter module | Woochan Kim, Vivek Kishorechand Arora, Kengo Aoya | 2023-03-07 |
| 11574855 | Package with dies mounted on opposing surfaces of a leadframe | Noboru Nakanishi | 2023-02-07 |
| 11387179 | IC package with half-bridge power module | Kengo Aoya, Woochan Kim, Vivek Kishorechand Arora | 2022-07-12 |
| 11217522 | Semiconductor apparatus and method having a lead frame with floating leads | — | 2022-01-04 |
| 11217513 | Integrated circuit package with pre-wetted contact sidewall surfaces | Daiki Komatsu | 2022-01-04 |
| 11088055 | Package with dies mounted on opposing surfaces of a leadframe | Noboru Nakanishi | 2021-08-10 |
| 11062980 | Integrated circuit packages with wettable flanks and methods of manufacturing the same | Daiki Komatsu | 2021-07-13 |
| 11004742 | Methods and apparatus for an improved integrated circuit package | — | 2021-05-11 |
| 10935300 | Refrigerator including a detachably mounted cooling unit | Hitoshi Takase, Shingo IMANO, Tomoharu Iwamoto, Tomohiko Matsuno, Tatsuya Seo | 2021-03-02 |
| 10636729 | Integrated circuit package with pre-wetted contact sidewall surfaces | Daiki Komatsu | 2020-04-28 |
| 10566269 | Low stress integrated circuit package | — | 2020-02-18 |
| 10541220 | Printed repassivation for wafer chip scale packaging | Daiki Komatsu, Yi Yan, Hau Nguyen, Luu Thanh Nguyen, Anindya Poddar | 2020-01-21 |