| 12400785 |
Multi-layer coil component |
Akihiko OIDE, Tomoki Okada, Hideki Saitou, Seiji Osada, Kazuhiro EBINA +4 more |
2025-08-26 |
| 12347597 |
Multi-layer inductor |
Akihiko OIDE, Tomoki Okada, Seiji Osada, Yuuki Okazaki, Takeshi Sasaki +5 more |
2025-07-01 |
| 12347607 |
Multi-layer coil component |
Yuya OSHIMA, Kenji KOMORITA, Masayuki Suzuki, Yuudai Katou, Takeru Sasaki +5 more |
2025-07-01 |
| 12347596 |
Multi-layer inductor |
Akihiko OIDE, Tomoki Okada, Seiji Osada, Yuuki Okazaki, Takeshi Sasaki +5 more |
2025-07-01 |
| 12334247 |
Multi-layer coil component |
Akihiko OIDE, Tomoki Okada, Hideki Saitou, Seiji Osada, Kazuhiro EBINA +4 more |
2025-06-17 |
| 12125627 |
Multilayer inductor component |
Daiki Kato, Masashi SHIMOYASU, Yoji Tozawa, Seiichi Nakagawa, Akihiko OIDE +1 more |
2024-10-22 |
| 12094642 |
Multilayer inductor component |
Masashi SHIMOYASU, Daiki Kato, Yoji Tozawa, Takashi Endo, Seiichi Nakagawa +4 more |
2024-09-17 |
| 12080142 |
Information presentation method, information presentation system, and information presentation apparatus |
Masaya Yamamoto, Tomoki Ogawa, Kunio Gobara, Atsushi Tanaka, Masashi HITOTSUYA |
2024-09-03 |
| 12046542 |
Heat-dissipating wirebonded members on package surfaces |
Makoto Shibuya, Kengo Aoya |
2024-07-23 |
| 12040122 |
Multilayer coil component |
Youichi KAZUTA, Hajime Kato, Kazuya TOBITA, Yuto SHIGA, Noriaki HAMACHI |
2024-07-16 |
| 12021019 |
Semiconductor device package with thermal pad |
Anindya Poddar, Ashok S. Prabhu, Edgar Dorotyao Balidoy, Hau Nguyen, Ming-Yang Li |
2024-06-25 |
| 11894195 |
Electronic component |
Yoji Tozawa, Masashi SHIMOYASU, Takuo Abe, Akihiko OIDE, Tsutomu Ono +3 more |
2024-02-06 |
| 11830664 |
Multilayer coil component |
Hajime Kato, Hidekazu Sato, Kazuya TOBITA, Yuto SHIGA, Youichi KAZUTA +1 more |
2023-11-28 |
| 11791088 |
Multilayer coil component |
Kazuya TOBITA, Hajime Kato, Youichi KAZUTA, Yuto SHIGA, Noriaki HAMACHI |
2023-10-17 |
| 11735347 |
Multilayer coil component |
Yuto SHIGA, Hajime Kato, Kazuya TOBITA, Youichi KAZUTA, Noriaki HAMACHI |
2023-08-22 |
| 11610709 |
Electronic component |
Yuto SHIGA, Hajime Kato, Kazuya TOBITA, Youichi KAZUTA, Noriaki HAMACHI |
2023-03-21 |
| 11569020 |
Coil component |
Hajime Kato, Satoru Okamoto, Masahiro Kato, Kazuya TOBITA, Yuto SHIGA +2 more |
2023-01-31 |
| 11527350 |
Multilayer coil component |
Yuto SHIGA, Hajime Kato, Kazuya TOBITA, Youichi KAZUTA, Noriaki HAMACHI |
2022-12-13 |
| 11498831 |
Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip |
Kurt Peter Wachtler, Ayumu Kuroda, Brian E. Goodlin, Karen Hildegard Ralston Kirmse, Benjamin Stassen Cook +2 more |
2022-11-15 |
| 11450638 |
Bump bond structure for enhanced electromigration performance |
Dibyajat Mishra, Ashok S. Prabhu, Tomoko Noguchi, Luu Thanh Nguyen, Anindya Poddar +1 more |
2022-09-20 |
| 11227721 |
Electronic component |
Yoji Tozawa, Masashi SHIMOYASU, Takuo Abe, Akihiko OIDE, Tsutomu Ono +6 more |
2022-01-18 |
| 11189413 |
Multilayer coil component and method for producing the same |
Yuya OSHIMA, Shinichi Kondo, Junichi Otsuka, Yohei TADAKI, Kazuo Iwai +4 more |
2021-11-30 |
| 11127529 |
Method of manufacturing laminated coil component |
Yuya OSHIMA, Yoji Tozawa, Junichi Otsuka, Kazuo Iwai, Yohei TADAKI +3 more |
2021-09-21 |
| 10848119 |
Electronic component |
Akihiko OIDE, Yoji Tozawa, Seiichi Nakagawa, Shinichi Kondo, Takashi Endo +1 more |
2020-11-24 |
| 10784834 |
Lamination type LC filter array |
Akihiko OIDE, Naoki Uchida, Yoji Tozawa, Seiichi Nakagawa, Shinichi Sato +2 more |
2020-09-22 |
