Issued Patents All Time
Showing 1–25 of 63 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11450638 | Bump bond structure for enhanced electromigration performance | Dibyajat Mishra, Ashok S. Prabhu, Tomoko Noguchi, Anindya Poddar, Makoto Yoshino +1 more | 2022-09-20 |
| 11410875 | Fan-out electronic device | Hau Nguyen, Woochan Kim, Yi Yan, Ashok S. Prabhu, Anindya Poddar +3 more | 2022-08-09 |
| 11367699 | Integrated circuit backside metallization | Hiroyuki Sada, Shoichi Iriguchi, Genki Yano, Ashok S. Prabhu, Anindya Poddar +2 more | 2022-06-21 |
| 11082028 | 3D-printed protective shell structures with support columns for stress sensitive circuits | James Cooper Wainerdi, Alexander Harvey Scheuermann, Matthew David Romig | 2021-08-03 |
| 11031311 | Packaged semiconductor device with multilayer stress buffer | — | 2021-06-08 |
| 11021786 | Copper passivation | Mahmud Halim Chowdhury, Ashok S. Prabhu, Anindya Poddar | 2021-06-01 |
| 10763231 | Bump bond structure for enhanced electromigration performance | Dibyajat Mishra, Ashok S. Prabhu, Tomoko Noguchi, Anindya Poddar, Makoto Yoshino +1 more | 2020-09-01 |
| 10763230 | Integrated circuit backside metallization | Hiroyuki Sada, Shoichi Iriguchi, Genki Yano, Ashok S. Prabhu, Anindya Poddar +2 more | 2020-09-01 |
| 10650957 | Additive deposition low temperature curable magnetic interconnecting layer for power components integration | Yi Yan, Ashok S. Prabhu, Anindya Poddar | 2020-05-12 |
| 10541220 | Printed repassivation for wafer chip scale packaging | Daiki Komatsu, Makoto Shibuya, Yi Yan, Hau Nguyen, Anindya Poddar | 2020-01-21 |
| 10516381 | 3D-printed protective shell structures for stress sensitive circuits | James Cooper Wainerdi, Alexander Harvey Scheuermann, Matthew David Romig | 2019-12-24 |
| 10077186 | Integrated circuit package with sensor and method of making | Makoto Shibuya, Noboru Nakanishi | 2018-09-18 |
| 9688530 | Integrated circuit package with sensor and method of making | Makoto Shibuya, Noboru Nakanishi | 2017-06-27 |
| 9663357 | Open cavity package using chip-embedding technology | Jie Mao, Hau Nguyen, Anindya Poddar | 2017-05-30 |
| 8716830 | Thermally efficient integrated circuit package | Anindya Poddar | 2014-05-06 |
| 7824963 | Inkjet printed leadframe | Randall L. Walberg, Anindya Poddar | 2010-11-02 |
| 7808089 | Leadframe having die attach pad with delamination and crack-arresting features | Vijaylaxmi Gumaste | 2010-10-05 |
| 7728399 | Molded optical package with fiber coupling feature | Randall L. Walberg, Robert P. Dahlgren, James B. Wieser, Kenneth D. Pedrotti, Jacob Adams Wysocki | 2010-06-01 |
| 7703993 | Wafer level optoelectronic package with fiber side insertion | Artur Darbinyan, Anindya Poddar | 2010-04-27 |
| 7667304 | Inkjet printed leadframes | Randall L. Walberg, Anindya Poddar | 2010-02-23 |
| 7651891 | Integrated circuit package with stress reduction | — | 2010-01-26 |
| 7432575 | Two-layer electrical substrate for optical devices | Neeraj Pendse, Jia Liu, Jitendra Mohan, Bruce Carlton Roberts, William Paul Mazotti | 2008-10-07 |
| 7431516 | Optical sub-assembly packaging techniques that incorporate optical lenses | William Paul Mazotti, Jia Liu, Haryanto Chandra, Peter Deane, Todd Thyes +3 more | 2008-10-07 |
| 7269027 | Ceramic optical sub-assembly for optoelectronic modules | Jia Liu, Ken Pham, William Paul Mazotti, Bruce Carlton Roberts, Stephen Gee +1 more | 2007-09-11 |
| 7253078 | Method and apparatus for forming an underfill adhesive layer | Hau Nguyen, Viraj A. Patwardhan, Nikhil Kelkar, Shahram Mostafazadeh | 2007-08-07 |