| 11450638 |
Bump bond structure for enhanced electromigration performance |
Dibyajat Mishra, Ashok S. Prabhu, Tomoko Noguchi, Anindya Poddar, Makoto Yoshino +1 more |
2022-09-20 |
$47,694,000 |
| 11410875 |
Fan-out electronic device |
Hau Nguyen, Woochan Kim, Yi Yan, Ashok S. Prabhu, Anindya Poddar +3 more |
2022-08-09 |
$38,405,000 |
| 11367699 |
Integrated circuit backside metallization |
Hiroyuki Sada, Shoichi Iriguchi, Genki Yano, Ashok S. Prabhu, Anindya Poddar +2 more |
2022-06-21 |
$32,959,000 |
| 11082028 |
3D-printed protective shell structures with support columns for stress sensitive circuits |
James Cooper Wainerdi, Alexander Harvey Scheuermann, Matthew David Romig |
2021-08-03 |
$28,719,000 |
| 11031311 |
Packaged semiconductor device with multilayer stress buffer |
— |
2021-06-08 |
$50,580,000 |
| 11021786 |
Copper passivation |
Mahmud Halim Chowdhury, Ashok S. Prabhu, Anindya Poddar |
2021-06-01 |
$28,896,000 |
| 10763231 |
Bump bond structure for enhanced electromigration performance |
Dibyajat Mishra, Ashok S. Prabhu, Tomoko Noguchi, Anindya Poddar, Makoto Yoshino +1 more |
2020-09-01 |
$30,772,000 |
| 10763230 |
Integrated circuit backside metallization |
Hiroyuki Sada, Shoichi Iriguchi, Genki Yano, Ashok S. Prabhu, Anindya Poddar +2 more |
2020-09-01 |
$30,772,000 |
| 10650957 |
Additive deposition low temperature curable magnetic interconnecting layer for power components integration |
Yi Yan, Ashok S. Prabhu, Anindya Poddar |
2020-05-12 |
$21,952,000 |
| 10541220 |
Printed repassivation for wafer chip scale packaging |
Daiki Komatsu, Makoto Shibuya, Yi Yan, Hau Nguyen, Anindya Poddar |
2020-01-21 |
$25,062,000 |
| 10516381 |
3D-printed protective shell structures for stress sensitive circuits |
James Cooper Wainerdi, Alexander Harvey Scheuermann, Matthew David Romig |
2019-12-24 |
$64,740,000 |
| 10077186 |
Integrated circuit package with sensor and method of making |
Makoto Shibuya, Noboru Nakanishi |
2018-09-18 |
$29,448,000 |
| 9688530 |
Integrated circuit package with sensor and method of making |
Makoto Shibuya, Noboru Nakanishi |
2017-06-27 |
$9,393,000 |
| 9663357 |
Open cavity package using chip-embedding technology |
Jie Mao, Hau Nguyen, Anindya Poddar |
2017-05-30 |
$10,900,000 |
| 8716830 |
Thermally efficient integrated circuit package |
Anindya Poddar |
2014-05-06 |
$6,215,000 |
| 7824963 |
Inkjet printed leadframe |
Randall L. Walberg, Anindya Poddar |
2010-11-02 |
$1,796,000 |
| 7808089 |
Leadframe having die attach pad with delamination and crack-arresting features |
Vijaylaxmi Gumaste |
2010-10-05 |
$3,019,000 |
| 7728399 |
Molded optical package with fiber coupling feature |
Randall L. Walberg, Robert P. Dahlgren, James B. Wieser, Kenneth D. Pedrotti, Jacob Adams Wysocki |
2010-06-01 |
$5,076,000 |
| 7703993 |
Wafer level optoelectronic package with fiber side insertion |
Artur Darbinyan, Anindya Poddar |
2010-04-27 |
$2,020,000 |
| 7667304 |
Inkjet printed leadframes |
Randall L. Walberg, Anindya Poddar |
2010-02-23 |
$9,783,000 |
| 7651891 |
Integrated circuit package with stress reduction |
— |
2010-01-26 |
$4,828,000 |
| 7432575 |
Two-layer electrical substrate for optical devices |
Neeraj Pendse, Jia Liu, Jitendra Mohan, Bruce Carlton Roberts, William Paul Mazotti |
2008-10-07 |
$4,060,000 |
| 7431516 |
Optical sub-assembly packaging techniques that incorporate optical lenses |
William Paul Mazotti, Jia Liu, Haryanto Chandra, Peter Deane, Todd Thyes +3 more |
2008-10-07 |
$4,060,000 |
| 7269027 |
Ceramic optical sub-assembly for optoelectronic modules |
Jia Liu, Ken Pham, William Paul Mazotti, Bruce Carlton Roberts, Stephen Gee +1 more |
2007-09-11 |
$5,506,000 |
| 7253078 |
Method and apparatus for forming an underfill adhesive layer |
Hau Nguyen, Viraj A. Patwardhan, Nikhil Kelkar, Shahram Mostafazadeh |
2007-08-07 |
$6,797,000 |
