Issued Patents All Time
Showing 51–63 of 63 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6364542 | Device and method for providing a true semiconductor die to external fiber optic cable connection | Peter Deane, Chen H. Tsay, Cade Murray | 2002-04-02 |
| 6352881 | Method and apparatus for forming an underfill adhesive layer | Nikhil Kelkar, Christopher Quentin, Ashok S. Prabhu, Hem Takiar | 2002-03-05 |
| 6245595 | Techniques for wafer level molding of underfill encapsulant | Hem Takiar, Ethan Warner, Shahram Mostafazadeh, Joseph O. Smith | 2001-06-12 |
| 6238949 | Method and apparatus for forming a plastic chip on chip package module | Ashok S. Prabhu, Nikhil Kelkar, Hem Takiar | 2001-05-29 |
| 5437095 | Method of making plastic encapsulated integrated circuit package | Hem Takiar | 1995-08-01 |
| 5422435 | Stacked multi-chip modules and method of manufacturing | Hem Takiar, Peng-Cheng Lin | 1995-06-06 |
| 5328079 | Method of and arrangement for bond wire connecting together certain integrated circuit components | Ranjan J. Mathew, Arnold R. Smith | 1994-07-12 |
| 5296743 | Plastic encapsulated integrated circuit package and method of manufacturing the same | Hem Takiar | 1994-03-22 |
| 5130781 | Dam for lead encapsulation | Caroline A. Kovac, Peter G. Ledermann | 1992-07-14 |
| 5049201 | Method of inhibiting corrosion in an electronic package | Shirley N. Cheng, Constance J. Araps, Allen J. Arnold, Jeffrey T. Coffin | 1991-09-17 |
| 4934309 | Solder deposition system | Peter G. Ledermann | 1990-06-19 |
| 4898117 | Solder deposition system | Peter G. Ledermann | 1990-02-06 |
| 4881885 | Dam for lead encapsulation | Caroline A. Kovac, Peter G. Ledermann | 1989-11-21 |