Issued Patents All Time
Showing 1–25 of 55 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12255153 | Wire bond wires for interference shielding | Abiola Awujoola, Zhuowen Sun, Wael Zohni, Willmar Subido | 2025-03-18 |
| 12021019 | Semiconductor device package with thermal pad | Anindya Poddar, Edgar Dorotyao Balidoy, Hau Nguyen, Makoto Yoshino, Ming-Yang Li | 2024-06-25 |
| 11955456 | Flip chip packaged devices with thermal pad | Anindya Poddar, Hau Nguyen, Kurt Sincerbox, Makoto Shibuya | 2024-04-09 |
| 11810867 | Wire bond wires for interference shielding | Abiola Awujoola, Zhuowen Sun, Wael Zohni, Willmar Subido | 2023-11-07 |
| 11462483 | Wire bond wires for interference shielding | Abiola Awujoola, Zhuowen Sun, Wael Zohni, Willmar Subido | 2022-10-04 |
| 11450638 | Bump bond structure for enhanced electromigration performance | Dibyajat Mishra, Tomoko Noguchi, Luu Thanh Nguyen, Anindya Poddar, Makoto Yoshino +1 more | 2022-09-20 |
| 11410875 | Fan-out electronic device | Hau Nguyen, Woochan Kim, Yi Yan, Luu Thanh Nguyen, Anindya Poddar +3 more | 2022-08-09 |
| 11367699 | Integrated circuit backside metallization | Hiroyuki Sada, Shoichi Iriguchi, Genki Yano, Luu Thanh Nguyen, Anindya Poddar +2 more | 2022-06-21 |
| 11021786 | Copper passivation | Luu Thanh Nguyen, Mahmud Halim Chowdhury, Anindya Poddar | 2021-06-01 |
| 10763230 | Integrated circuit backside metallization | Hiroyuki Sada, Shoichi Iriguchi, Genki Yano, Luu Thanh Nguyen, Anindya Poddar +2 more | 2020-09-01 |
| 10763231 | Bump bond structure for enhanced electromigration performance | Dibyajat Mishra, Tomoko Noguchi, Luu Thanh Nguyen, Anindya Poddar, Makoto Yoshino +1 more | 2020-09-01 |
| 10650957 | Additive deposition low temperature curable magnetic interconnecting layer for power components integration | Yi Yan, Luu Thanh Nguyen, Anindya Poddar | 2020-05-12 |
| 10559537 | Wire bond wires for interference shielding | Abiola Awujoola, Zhuowen Sun, Wael Zohni, Willmar Subido | 2020-02-11 |
| 10490528 | Embedded wire bond wires | Abiola Awujoola, Wael Zohni, Willmar Subido | 2019-11-26 |
| 10354976 | Dies-on-package devices and methods therefor | Min Tao, Hoki Kim, Zhuowen Sun, Wael Zohni, Belgacem Haba | 2019-07-16 |
| 10325877 | Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces | Javier A. Delacruz, Abiola Awujoola, Christopher W. Lattin, Zhuowen Sun | 2019-06-18 |
| 10181457 | Microelectronic package for wafer-level chip scale packaging with fan-out | Rajesh Katkar | 2019-01-15 |
| 10115678 | Wire bond wires for interference shielding | Abiola Awujoola, Zhuowen Sun, Wael Zohni, Willmar Subido | 2018-10-30 |
| 10043779 | Packaged microelectronic device for a package-on-package device | Rajesh Katkar | 2018-08-07 |
| 9991235 | Package on-package devices with upper RDL of WLPS and methods therefor | Min Tao, Hoki Kim, Zhuowen Sun, Wael Zohni, Belgacem Haba | 2018-06-05 |
| 9991233 | Package-on-package devices with same level WLP components and methods therefor | Min Tao, Hoki Kim, Zhuowen Sun, Wael Zohni, Belgacem Haba | 2018-06-05 |
| 9985007 | Package on-package devices with multiple levels and methods therefor | Min Tao, Hoki Kim, Zhuowen Sun, Wael Zohni, Belgacem Haba | 2018-05-29 |
| 9984992 | Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces | Javier A. Delacruz, Abiola Awujoola, Christopher W. Lattin, Zhuowen Sun | 2018-05-29 |
| 9972609 | Package-on-package devices with WLP components with dual RDLs for surface mount dies and methods therefor | Min Tao, Hoki Kim, Zhuowen Sun, Wael Zohni, Belgacem Haba | 2018-05-15 |
| 9972573 | Wafer-level packaged components and methods therefor | Min Tao, Hoki Kim, Zhuowen Sun, Wael Zohni, Belgacem Haba | 2018-05-15 |