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Laser dicing for singulation |
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| 11664276 |
Front side laser-based wafer dicing |
Matthew John Sherbin, Michael Todd Wyant, Christopher Daniel Manack, Hiroyuki Sada, Genki Yano +2 more |
2023-05-30 |
| 11482442 |
Subring for semiconductor dies |
Matthew John Sherbin, Michael Todd Wyant, Dave Charles Stepniak, Sada Hiroyuki, Genki Yano |
2022-10-25 |
| 11469141 |
Laser dicing for singulation |
Michael Todd Wyant, Dave Charles Stepniak, Matthew John Sherbin, Sada Hiroyuki, Genki Yano |
2022-10-11 |
| 11367699 |
Integrated circuit backside metallization |
Hiroyuki Sada, Genki Yano, Luu Thanh Nguyen, Ashok S. Prabhu, Anindya Poddar +2 more |
2022-06-21 |
| 11171031 |
Die matrix expander with partitioned subring |
Matthew John Sherbin, Michael Todd Wyant, Dave Charles Stepniak, Hiroyuki Sada, Genki Yano |
2021-11-09 |
| 10763230 |
Integrated circuit backside metallization |
Hiroyuki Sada, Genki Yano, Luu Thanh Nguyen, Ashok S. Prabhu, Anindya Poddar +2 more |
2020-09-01 |
| 10658240 |
Semiconductor die singulation |
Hiroyuki Sada, Genki Yano |
2020-05-19 |
| 8993412 |
Method for reducing backside die damage during die separation process |
Noboru Nakanishi |
2015-03-31 |