| 12512416 |
Laser ablation for die separation to reduce laser splash and electronic device |
Michael Todd Wyant, Joseph Liu |
2025-12-30 |
|
| 12394671 |
Efficient removal of street test devices during wafer dicing |
Michael Todd Wyant, Joseph Liu |
2025-08-19 |
|
| 12255115 |
Electronic devices in semiconductor package cavities |
Patrick Francis Thompson, Qiao Chen |
2025-03-18 |
|
| 12237219 |
Contact with bronze material to mitigate undercut |
Nazila Dadvand, Salvatore Frank Pavone |
2025-02-25 |
|
| 12203776 |
Miniature sensor cavities |
Sreenivasan K. Koduri, Leslie Edward Stark |
2025-01-21 |
|
| 12142586 |
Efficient redistribution layer topology |
Vivek Swaminathan Sridharan, Joseph Liu |
2024-11-12 |
$32,376,000 |
| 12100678 |
Conductive members for die attach in flip chip packages |
Salvatore Frank Pavone, Maricel Fabia Escaño, Rafael Jose Lizares Guevara |
2024-09-24 |
$92,236,000 |
| 12074096 |
Die attach surface copper layer with protective layer for microelectronic devices |
Nazila Dadvand, Salvatore Frank Pavone |
2024-08-27 |
$38,380,000 |
| 12068221 |
Plating for thermal management |
Nazila Dadvand, Salvatore Frank Pavone |
2024-08-20 |
$49,911,000 |
| 12062597 |
Three dimensional package for semiconductor devices and external components |
Sreenivasan K. Koduri |
2024-08-13 |
$79,387,000 |
| 12009319 |
Integrated circuit with metal stop ring outside the scribe seal |
Qiao Chen, Michael Todd Wyant, Matthew John Sherbin, Patrick Francis Thompson |
2024-06-11 |
$44,466,000 |
| 11984418 |
Method of forming brass-coated metals in flip-chip redistribution layers |
Vivek Swaminathan Sridharan, Nazila Dadvand, Salvatore Frank Pavone, Patrick Francis Thompson |
2024-05-14 |
$51,038,000 |
| 11978709 |
Integrated system-in-package with radiation shielding |
Vivek Swaminathan Sridharan, Yiqi Tang, Rajen Manicon Murugan, Liang Wan, Hiep Xuan Nguyen |
2024-05-07 |
$43,677,000 |
| 11942386 |
Electronic devices in semiconductor package cavities |
Patrick Francis Thompson, Qiao Chen |
2024-03-26 |
$28,354,000 |
| 11869820 |
IC having a metal ring thereon for stress reduction |
Amit Sureshkumar Nangia, Sreenivasan K. Koduri, Siva Prakash Gurrum |
2024-01-09 |
$22,697,000 |
| 11854922 |
Semicondutor package substrate with die cavity and redistribution layer |
Vivek Swaminathan Sridharan, Joseph Liu |
2023-12-26 |
$25,539,000 |
| 11855024 |
Wafer chip scale packages with visible solder fillets |
Qiao Chen, Vivek Swaminathan Sridharan, Patrick Francis Thompson, Jonathan Andrew Montoya, Salvatore Frank Pavone |
2023-12-26 |
$25,539,000 |
| 11837518 |
Coated semiconductor dies |
Michael Todd Wyant, Matthew John Sherbin, Patrick Francis Thompson, You Chye How |
2023-12-05 |
$30,679,000 |
| 11664276 |
Front side laser-based wafer dicing |
Matthew John Sherbin, Michael Todd Wyant, Hiroyuki Sada, Shoichi Iriguchi, Genki Yano +2 more |
2023-05-30 |
$73,456,000 |
| 11631632 |
Three dimensional package for semiconductor devices and external components |
Sreenivasan K. Koduri |
2023-04-18 |
$65,786,000 |
| 11616038 |
Interconnect for electronic device |
Patrick Francis Thompson, Stefan Herzer, Rakshit Agrawal |
2023-03-28 |
$31,423,000 |
| 11594504 |
Nickel alloy for semiconductor packaging |
Nazila Dadvand, Salvatore Frank Pavone |
2023-02-28 |
$29,378,000 |
| 11587858 |
Zinc-cobalt barrier for interface in solder bond applications |
Nazila Dadvand, Salvatore Frank Pavone |
2023-02-21 |
$28,405,000 |
| 11562949 |
Semiconductor package including undermounted die with exposed backside metal |
Patrick Francis Thompson, Madison Paige Koziol |
2023-01-24 |
$65,918,000 |
| 11443996 |
Zinc layer for a semiconductor die pillar |
Nazila Dadvand, Keith Edward Johnson, Salvatore Frank Pavone |
2022-09-13 |
$31,603,000 |