Issued Patents All Time
Showing 25 most recent of 48 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394671 | Efficient removal of street test devices during wafer dicing | Michael Todd Wyant, Joseph Liu | 2025-08-19 |
| 12255115 | Electronic devices in semiconductor package cavities | Patrick Francis Thompson, Qiao Chen | 2025-03-18 |
| 12237219 | Contact with bronze material to mitigate undercut | Nazila Dadvand, Salvatore Frank Pavone | 2025-02-25 |
| 12203776 | Miniature sensor cavities | Sreenivasan K. Koduri, Leslie Edward Stark | 2025-01-21 |
| 12142586 | Efficient redistribution layer topology | Vivek Swaminathan Sridharan, Joseph Liu | 2024-11-12 |
| 12100678 | Conductive members for die attach in flip chip packages | Salvatore Frank Pavone, Maricel Fabia Escaño, Rafael Jose Lizares Guevara | 2024-09-24 |
| 12074096 | Die attach surface copper layer with protective layer for microelectronic devices | Nazila Dadvand, Salvatore Frank Pavone | 2024-08-27 |
| 12068221 | Plating for thermal management | Nazila Dadvand, Salvatore Frank Pavone | 2024-08-20 |
| 12062597 | Three dimensional package for semiconductor devices and external components | Sreenivasan K. Koduri | 2024-08-13 |
| 12009319 | Integrated circuit with metal stop ring outside the scribe seal | Qiao Chen, Michael Todd Wyant, Matthew John Sherbin, Patrick Francis Thompson | 2024-06-11 |
| 11984418 | Method of forming brass-coated metals in flip-chip redistribution layers | Vivek Swaminathan Sridharan, Nazila Dadvand, Salvatore Frank Pavone, Patrick Francis Thompson | 2024-05-14 |
| 11978709 | Integrated system-in-package with radiation shielding | Vivek Swaminathan Sridharan, Yiqi Tang, Rajen Manicon Murugan, Liang Wan, Hiep Xuan Nguyen | 2024-05-07 |
| 11942386 | Electronic devices in semiconductor package cavities | Patrick Francis Thompson, Qiao Chen | 2024-03-26 |
| 11869820 | IC having a metal ring thereon for stress reduction | Amit Sureshkumar Nangia, Sreenivasan K. Koduri, Siva Prakash Gurrum | 2024-01-09 |
| 11854922 | Semicondutor package substrate with die cavity and redistribution layer | Vivek Swaminathan Sridharan, Joseph Liu | 2023-12-26 |
| 11855024 | Wafer chip scale packages with visible solder fillets | Qiao Chen, Vivek Swaminathan Sridharan, Patrick Francis Thompson, Jonathan Andrew Montoya, Salvatore Frank Pavone | 2023-12-26 |
| 11837518 | Coated semiconductor dies | Michael Todd Wyant, Matthew John Sherbin, Patrick Francis Thompson, You Chye How | 2023-12-05 |
| 11664276 | Front side laser-based wafer dicing | Matthew John Sherbin, Michael Todd Wyant, Hiroyuki Sada, Shoichi Iriguchi, Genki Yano +2 more | 2023-05-30 |
| 11631632 | Three dimensional package for semiconductor devices and external components | Sreenivasan K. Koduri | 2023-04-18 |
| 11616038 | Interconnect for electronic device | Patrick Francis Thompson, Stefan Herzer, Rakshit Agrawal | 2023-03-28 |
| 11594504 | Nickel alloy for semiconductor packaging | Nazila Dadvand, Salvatore Frank Pavone | 2023-02-28 |
| 11587858 | Zinc-cobalt barrier for interface in solder bond applications | Nazila Dadvand, Salvatore Frank Pavone | 2023-02-21 |
| 11562949 | Semiconductor package including undermounted die with exposed backside metal | Patrick Francis Thompson, Madison Paige Koziol | 2023-01-24 |
| 11443996 | Zinc layer for a semiconductor die pillar | Nazila Dadvand, Keith Edward Johnson, Salvatore Frank Pavone | 2022-09-13 |
| 11410947 | Brass-coated metals in flip-chip redistribution layers | Vivek Swaminathan Sridharan, Nazila Dadvand, Salvatore Frank Pavone, Patrick Francis Thompson | 2022-08-09 |