Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11837518 | Coated semiconductor dies | Michael Todd Wyant, Matthew John Sherbin, Christopher Daniel Manack, Patrick Francis Thompson | 2023-12-05 |
| 11830791 | Leads for leadframe and semiconductor package | Anis Fauzi Bin Abdul Aziz | 2023-11-28 |
| 11328984 | Multi-die integrated circuit packages and methods of manufacturing the same | Huay Yann Tay, Franklin Santos Marcelino | 2022-05-10 |
| 10804114 | Methods for making a multilevel leadframe by etching a conductive sheet from two opposite sides | Lee Han Meng@ Eugene Lee | 2020-10-13 |
| 10381293 | Integrated circuit package having an IC die between top and bottom leadframes | Lee Han Meng@Eugene Lee, Chong Han Lim | 2019-08-13 |
| 10079162 | Method for making lead frames for integrated circuit packages | — | 2018-09-18 |
| 9978613 | Method for making lead frames for integrated circuit packages | — | 2018-05-22 |
| 9620388 | Integrated circuit package fabrication with die attach paddle having middle channels | Maria Christina Bernardo Violante | 2017-04-11 |
| 9202778 | Integrated circuit package with die attach paddle having at least one recessed portion | Maria Christina Bernando Violante | 2015-12-01 |
| 9123626 | Integrated passive flip chip package | Siew Kee Lee, Huay Yann Tay | 2015-09-01 |
| 8647966 | Method and apparatus for dicing die attach film on a semiconductor wafer | Ken Fei Lim, Kooi Choon OOI | 2014-02-11 |
| 8048781 | Methods and systems for packaging integrated circuits | — | 2011-11-01 |
| 8030138 | Methods and systems of packaging integrated circuits | Shee Min Yeong, Peng-Soon Lim, Sek Hoi Chong | 2011-10-04 |
| 8018050 | Integrated circuit package with integrated heat sink | Shee Min Yeong | 2011-09-13 |
| 7868433 | Low stress cavity package | Peng-Soon Lim, Shee Min Yeong | 2011-01-11 |
| 7863757 | Methods and systems for packaging integrated circuits | Shee Min Yeong | 2011-01-04 |
| 7749809 | Methods and systems for packaging integrated circuits | Shee Min Yeong | 2010-07-06 |
| 7582954 | Optical leadless leadframe package | Peng-Soon Lim, Terh Kuen Yii, Sek Hoi Chong, Shee Min Yeong | 2009-09-01 |
| 6972244 | Marking semiconductor devices through a mount tape | Viraj A. Patwardhan, Nikhil Vishwanath Kelkar, Tian Oon Goh, Soi Chong Low | 2005-12-06 |