Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12119289 | Semiconductor packages with roughened conductive components | Yee Gin TEA | 2024-10-15 |
| 11791170 | Universal semiconductor package molds | Anis Fauzi Bin Abdul Aziz, Lee Han Meng@Eugene Lee, Wei Fen Sueann Lim | 2023-10-17 |
| 11715678 | Roughened conductive components | Yee Gin TEA | 2023-08-01 |
| 11626350 | Cutting a leadframe assembly with a plurality of punching tools | Lee Han Meng@Eugene Lee, Anis Fauzi Bin Abdul Aziz, Wei Fen Sueann Lim, Siew Kee Lee | 2023-04-11 |
| 10381293 | Integrated circuit package having an IC die between top and bottom leadframes | Lee Han Meng@Eugene Lee, You Chye How | 2019-08-13 |
| 6940299 | Method of testing for short circuits between adjacent input/output pins of an integrated circuit | Heng Wai Seng, Chee Keong Low | 2005-09-06 |