Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087674 | Spring bar leadframe, method and packaged electronic device with zero draft angle | Anis Fauzi Bin Abdul Aziz, Sueann Wei Fen Lim, Jin Keong Lim | 2024-09-10 |
| 11791170 | Universal semiconductor package molds | Anis Fauzi Bin Abdul Aziz, Chong Han Lim, Wei Fen Sueann Lim | 2023-10-17 |
| 11626350 | Cutting a leadframe assembly with a plurality of punching tools | Chong Han Lim, Anis Fauzi Bin Abdul Aziz, Wei Fen Sueann Lim, Siew Kee Lee | 2023-04-11 |
| 11569152 | Electronic device with lead pitch gap | Anis Fauzi Bin Abdul Aziz, Wei Fen Sueann Lim, Siew Kee Lee | 2023-01-31 |
| 11373940 | Method of making leadframe strip | Anis Fauzi Bin Abdul Aziz, Wei Fen Sueann Lim | 2022-06-28 |
| 11264310 | Spring bar leadframe, method and packaged electronic device with zero draft angle | Anis Fauzi Bin Abdul Aziz, Sueann Wei Fen Lim, Jin Keong Lim | 2022-03-01 |
| 10784190 | Method of making leadframe strip | Anis Fauzi Bin Abdul Aziz, Wei Fen Sueann Lim | 2020-09-22 |
| 10381293 | Integrated circuit package having an IC die between top and bottom leadframes | Chong Han Lim, You Chye How | 2019-08-13 |
| 10115660 | Leadframe strip with vertically offset die attach pads between adjacent vertical leadframe columns | Anis Fauzi Bin Abdul Aziz, Wei Fen Sueann Lim | 2018-10-30 |
| 9741643 | Leadframe strip with vertically offset die attach pads between adjacent vertical leadframe columns | Anis Fauzi Bin Abdul Aziz, Sueann Lim Wei Fen | 2017-08-22 |
| 9029194 | Making an integrated circuit module with dual leadframes | Anis Fauzi bin Abdul Aziz, Susan Goh Geok Ling, Ng Swee Tiang | 2015-05-12 |
| 9013028 | Integrated circuit package and method of making | Sueann Lim Wei Fen, Sarel Bin Ismail | 2015-04-21 |
| 8884414 | Integrated circuit module with dual leadframe | Anis Fauzi bin Abdul Aziz, Susan Goh Geok Ling, Ng Swee Tiang | 2014-11-11 |
| 8847370 | Exposed die package that helps protect the exposed die from damage | Kok Leong Yeo, Kooi Choon OOI, Chen Seong CHUA | 2014-09-30 |
| 8779566 | Flexible routing for high current module application | Yien Sien Khoo, Kuan Yee Woo | 2014-07-15 |
| 8736042 | Delamination resistant device package having raised bond surface and mold locking aperture | Felix C. Li, Yee Kim Lee, Peng-Soon Lim, Terh Kuen Yii | 2014-05-27 |
| 8304887 | Module package with embedded substrate and leadframe | Kuan Yee Woo | 2012-11-06 |
| 8203199 | Tie bar and mold cavity bar arrangements for multiple leadframe stack package | Kuan Yee Woo | 2012-06-19 |
| 8105063 | Three piece mold cavity design for packaging integrated circuits | — | 2012-01-31 |
| 8097934 | Delamination resistant device package having low moisture sensitivity | Felix C. Li, Yee Kim Lee, Peng-Soon Lim, Terh Kuen Yii | 2012-01-17 |
| 8093707 | Leadframe packages having enhanced ground-bond reliability | Shaw Wei Lee, Ein Sun Ng, Chue Siak Liu, Yee Kim Lee | 2012-01-10 |
| 7838980 | TO263 device package having low moisture sensitivity | Yee Kim Lee, Peng-Soon Lim, Terh Kuen Yii | 2010-11-23 |