Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8093707 | Leadframe packages having enhanced ground-bond reliability | Shaw Wei Lee, Chue Siak Liu, Lee Han Meng@Eugene Lee, Yee Kim Lee | 2012-01-10 |
| 7247931 | Semiconductor package and leadframe therefor having angled corners | Chuan Kiak Ng, Yeu Wen Lee | 2007-07-24 |
| 7105378 | Method of forming a leadframe for a semiconductor package | Chuan Kiak Ng, Yeu Wen Lee | 2006-09-12 |